MES Engineer: Wire Bond & Die Attach Equipment

Texas Instruments; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments is seeking an Equipment Engineer to lead MES implementation for wire bonding and die attach lines, with a 1‑month orientation and a 1–2 year project phase. You will transition to a production role to optimize uptime and automation in a high‑volume environment.

You’ll define workflows, data interlocks, and qualification requirements, then validate and deploy on the shop floor, collaborating with multiple functions. Strong communication and problem solving are essential.

Qualifications

• Bachelor's degree in a relevant engineering field
• Minimum 2 years hands-on semiconductor equipment experience in Wire Bond and/or Die Attach
• Strong communication and teamwork skills

Responsibilities

• Lead MES implementation and define equipment workflows and controls
• Translate shop-floor requirements into digital process designs and data collection needs
• Validate equipment integration scenarios and lead UAT on the production floor
• Transition to production to improve uptime and automate processes

Skills

Analytical thinking

Problem solving

Team collaboration

Time management

Communication skills

Education

Bachelor's degree in Electrical / Electrical & Computer / Chemical / Mechanical engineering

Tools

Siemens OpCenter MES

ASM equipment

KNS equipment

Job description

Texas Instruments is seeking an Equipment Engineer to lead MES implementation for wire bonding and die attach lines, with a 1‑month orientation and a 1–2 year project phase. You will transition to a production role to optimize uptime and automation in a high‑volume environment.

You’ll define workflows, data interlocks, and qualification requirements, then validate and deploy on the shop floor, collaborating with multiple functions. Strong communication and problem solving are essential.