MES-Driven Wire Bond & Die Attach Equipment Engineer

118-WW TMG MFG OPS; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

TI in Malaysia is seeking an Equipment Engineer to lead the MES implementation for wire bond and die attach lines. This is a multi-phase role starting with a 1-month TI orientation, then 1–2 years on the MES project team, followed by a production role focused on uptime and automation in a high-volume environment.

Ideal candidates hold a Bachelor's degree in a relevant engineering field, have hands-on semiconductor equipment experience in Wire Bond or Die Attach, and are capable of working in a

Qualifications

• Bachelor's degree in an engineering field related to the role.
• Minimum 2 years of semiconductor equipment experience in Wire Bond or Die Attach.
• Strong communication and problem-solving skills.

Responsibilities

• Lead MES implementation phases and define equipment workflows.
• Translate shop-floor needs into digital process designs and interlocks.
• Validate equipment integration and lead UAT on production floor.
• Transition to production role to improve uptime and automation.

Skills

MES expertise

Equipment maintenance

Data collection

Team collaboration

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Electrical Computer Engineering

Bachelor's degree in Chemical Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Materials Science Engineering

Tools

ASM

KNS

Job description

TI in Malaysia is seeking an Equipment Engineer to lead the MES implementation for wire bond and die attach lines. This is a multi-phase role starting with a 1-month TI orientation, then 1–2 years on the MES project team, followed by a production role focused on uptime and automation in a high-volume environment.

Ideal candidates hold a Bachelor's degree in a relevant engineering field, have hands-on semiconductor equipment experience in Wire Bond or Die Attach, and are capable of working in a