MES-Driven Wire Bond & Die Attach Process Engineer

Texas Instruments; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This role starts with a 1-month orientation, moves into a 1–2 year MES implementation project, and concludes with a production role to drive yield and efficiency through the digital framework.

Key responsibilities include leading MES design, developing digital process controls, validating workflows, and ensuring smooth deployment across manufacturing, quality, and

Qualifications

• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or related field.
• Strong hands-on semiconductor process experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience.
• Strong foundation in statistical process control, engineering change control and process release strategies.

Responsibilities

• MES Implementation (Project Phase): Drive manufacturing process design within the MES; define process flows, routing, material handling and traceability.
• Control & Exception Handling: Design digital logic for process controls, including automated holds, rework loops and material disposition.
• Alignment & Validation: Align requirements between manufacturing and quality teams; validate digital workflows and support UAT/deployment.
• Sustaining (Post-Project Phase): Transition to a production role; use MES data to improve yield and optimize process parameters (e.g., wedge bonding).

Skills

Wire Bond

Die Attach

Statistical Process Control

Engineering Change Control

Process Release Strategies

MES Experience

PAC Integration

Wedge Bonding

Education

Bachelor's degree in Chemical Engineering

Bachelor's degree in Chemistry

Bachelor's degree in Electrical Engineering

Bachelor's degree in Materials Science Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Physics

Tools

MES platforms (Siemens OpCenter)

PAC integration

Job description

Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This role starts with a 1-month orientation, moves into a 1–2 year MES implementation project, and concludes with a production role to drive yield and efficiency through the digital framework.

Key responsibilities include leading MES design, developing digital process controls, validating workflows, and ensuring smooth deployment across manufacturing, quality, and