Digital MES Process Engineer: Wire Bond & Die Attach

Texas Instruments Incorporated; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments Incorporated in Malaysia, Kuala Lumpur, seeks a Process Engineer to lead the digital design of Wire Bond and Die Attach manufacturing processes. A unique, multi-phase role includes a 1-month TI orientation, followed by deployment to a critical MES implementation project for 1–2 years.

After go-live, you return to a production role to drive yield and efficiency using digital controls. Key responsibilities include MES process design, control/exception handling, alignment with

Responsibilities

• MES implementation project: design manufacturing processes, define flows, routing and traceability.
• Control & exception handling: design digital logic for process controls, automated holds and rework.
• Alignment & validation: align requirements between manufacturing and quality; support UAT and deployment.
• Sustaining phase: transition to production, use MES data to improve yield and optimize wedge bonding.

Job description

Texas Instruments Incorporated in Malaysia, Kuala Lumpur, seeks a Process Engineer to lead the digital design of Wire Bond and Die Attach manufacturing processes. A unique, multi-phase role includes a 1-month TI orientation, followed by deployment to a critical MES implementation project for 1–2 years.

After go-live, you return to a production role to drive yield and efficiency using digital controls. Key responsibilities include MES process design, control/exception handling, alignment with