Wirebond & Die Attach Process Engineer (MES Project)

Texas Instruments Electronics Malaysia Sdn Bhd; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments Electronics Malaysia Sdn Bhd is seeking a Process Engineer to lead the digital design of MES-enabled manufacturing processes for Wire Bond and Die Attach. The role begins with a 1-month TI orientation, followed by 1–2 years on an MES implementation project, then returns to production to leverage digital process controls for yield and efficiency.

The candidate should have a Bachelor's degree in a relevant field and 2+ years of semiconductor process experience, with strong skills

Qualifications

• Bachelor's degree in a relevant field (Chemical Eng., Chemistry, Electrical/Mechanical/Materials Science, Physics)
• Minimum 2 years of semiconductor process experience in Wire Bond and/or Die Attach
• Strong SPC, engineering change control and process release practices
• Experience with MES platforms (e.g., Siemens OpCenter) and cross-system integration

Responsibilities

• MES Implementation: design process flows, routing, material handling and traceability within MES
• Control & Exception Handling: design digital logic for process controls and automated holds/rework loops
• Alignment & Validation: align requirements between manufacturing and quality teams; support UAT and deployment
• Sustaining: transition to production, use MES data for yield improvement, optimize parameters like wedge bonding

Skills

Wire Bond

Die Attach

Statistical Process Control

Engineering Change Control

Process Release

MES Platforms

Wedge Bonding

Problem Solving

Communication Skills

Team Collaboration

Time Management

Influence Relationships

Education

Bachelor's degree in Chemical Eng./Chemistry/EE/Materials/Mechanical/Physics

Tools

Siemens OpCenter

Job description

Texas Instruments Electronics Malaysia Sdn Bhd 4.2 View all jobs

Change the world. Love your job.
Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.

Key Responsibilities:

• MES Implementation (Project Phase): Drive manufacturing process design within the MES. Define process flows, routing, material handling, and traceability.
• Control & Exception Handling: Design the digital logic for process controls and exception handling, including automated holds, rework loops, and material disposition.
• Alignment & Validation: Align requirements between manufacturing and quality teams. Validate proposed digital workflows and support UAT and deployment.
• Sustaining (Post-Project Phase): Transition to a production role to manage process stability, use MES data for yield enhancement, and optimize process parameters (e.g., wedge bonding optimization) through the new digital framework.

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.Meet the people of TI
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn moreatTI.com.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• Strong hands-on semiconductor process experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience
• Strong foundation in statistical process control, engineering change control and process release strategies

Preferred qualifications:

• Experience working withMES platforms, whether Siemens OpCenter or another comparable MES productmodeling or configuration
• Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and elevate early
• Experience in optimizing process parameters for wedge bonding or die attach accuracy.
• Demonstrated strong analytical and problem solving skills
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result