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Texas Instruments Incorporated in Malaysia, Kuala Lumpur, seeks a Process Engineer to lead the digital design of Wire Bond and Die Attach manufacturing processes. A unique, multi-phase role includes a 1-month TI orientation, followed by deployment to a critical MES implementation project for 1–2 years.
After go-live, you return to a production role to drive yield and efficiency using digital controls. Key responsibilities include MES process design, control/exception handling, alignment with
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Texas Instruments is seeking a Process Engineer to lead the digital design of our Wire Bond and Die Attach manufacturing processes. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1-2 years. Once the system is live, you will return to a production role, using your knowledge of digital process controls to drive yield and efficiency.
Key Responsibilities: