Digital Wire Bond & Die Attach Process Engineer (MES Lead)

Texas Instruments Electronics Malaysia Sdn Bhd; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

Texas Instruments Electronics Malaysia Sdn Bhd is seeking a Process Engineer to lead the digital design of MES-enabled manufacturing processes for Wire Bond and Die Attach. The role begins with a 1-month TI orientation, followed by 1–2 years on an MES implementation project, then returns to production to leverage digital process controls for yield and efficiency.

The candidate should have a Bachelor's degree in a relevant field and 2+ years of semiconductor process experience, with strong skills

Qualifications

• Bachelor's degree in a relevant field (Chemical Eng., Chemistry, Electrical/Mechanical/Materials Science, Physics)
• Minimum 2 years of semiconductor process experience in Wire Bond and/or Die Attach
• Strong SPC, engineering change control and process release practices
• Experience with MES platforms (e.g., Siemens OpCenter) and cross-system integration

Responsibilities

• MES Implementation: design process flows, routing, material handling and traceability within MES
• Control & Exception Handling: design digital logic for process controls and automated holds/rework loops
• Alignment & Validation: align requirements between manufacturing and quality teams; support UAT and deployment
• Sustaining: transition to production, use MES data for yield improvement, optimize parameters like wedge bonding

Skills

Wire Bond

Die Attach

Statistical Process Control

Engineering Change Control

Process Release

MES Platforms

Wedge Bonding

Problem Solving

Communication Skills

Team Collaboration

Time Management

Influence Relationships

Education

Bachelor's degree in Chemical Eng./Chemistry/EE/Materials/Mechanical/Physics

Tools

Siemens OpCenter

Job description

Texas Instruments Electronics Malaysia Sdn Bhd is seeking a Process Engineer to lead the digital design of MES-enabled manufacturing processes for Wire Bond and Die Attach. The role begins with a 1-month TI orientation, followed by 1–2 years on an MES implementation project, then returns to production to leverage digital process controls for yield and efficiency.

The candidate should have a Bachelor's degree in a relevant field and 2+ years of semiconductor process experience, with strong skills