Wire Bond & Die Attach Equipment Engineer (MES Project)

Texas Instruments Incorporated

Kuala Lumpur

On-site

MYR 120,000 - 180,000

Full time

2 days ago

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Job summary

Texas Instruments Incorporated seeks an Equipment Engineer to drive MES implementation for Wire Bond and Die Attach lines. The role begins with a 1-month TI orientation, then a 1–2 year MES project phase before transitioning to a production role to optimize uptime.

The position requires hands-on semiconductor equipment experience and strong collaboration across functions in a high-volume manufacturing setting.

Qualifications

Minimum Bachelor’s degree in Electrical/EC/Mechanical/Materials or related field.
Strong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach (2+ years).

Responsibilities

Lead MES implementation activities across project phase, defining workflows and qualification requirements.
Translate shop-floor needs into digital process designs and data collection specs.
Validate integrations and lead UAT and production deployment.
Transition to production post-project to improve uptime and automation.

Skills

Verbal and written communication

Analytical thinking

Teamwork and collaboration

Initiative and drive for results

Time management

Education

Bachelor's degree in Electrical Engineering or related field

Tools

Siemens OpCenter

ASM equipment

KNS equipment

Job description

Job Description

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Wire Bond and Die Attach lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:

MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.
Integration & Data: Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.
Validation: Validate equipment integration scenarios and lead User Acceptance Testing (UAT) and deployment on the production floor.
Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.

Qualifications

Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
Strong hands‑on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience

Preferred Qualifications

Equipment experience with ASM and KNS
Experience working withMES platforms, whether Siemens OpCenter or another comparable MES productmodeling or configuration
Working awareness of PAC-related integration and adjacent automation flows, sufficient to identify cross-system impacts and elevate early
Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
Strong verbal and written communication skills
Demonstrated strong analytical, critical thinking and problem solving skills
Ability to work in teams and collaborate effectively with people in different functions
Ability to take the initiative and drive for results
Strong time management skills that enable on-time project delivery
Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
Demonstrated ability to build strong, influential relationship

About Us

Why TI?

Engineer your future. We empower our employees to truly open their career and development. ...
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Benefits that benefit you. ...

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn moreat TI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

Texas Instruments is an equal opportunity employer.

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

Job Info