Wire Bond & Die Attach Equipment Engineer (MES Project)

118-WW TMG MFG OPS; Kuala Lumpur; On-site; MYR 120,000 - 180,000; Full time

Job summary

TI in Malaysia is seeking an Equipment Engineer to lead the MES implementation for wire bond and die attach lines. This is a multi-phase role starting with a 1-month TI orientation, then 1–2 years on the MES project team, followed by a production role focused on uptime and automation in a high-volume environment.

Ideal candidates hold a Bachelor's degree in a relevant engineering field, have hands-on semiconductor equipment experience in Wire Bond or Die Attach, and are capable of working in a

Qualifications

• Bachelor's degree in an engineering field related to the role.
• Minimum 2 years of semiconductor equipment experience in Wire Bond or Die Attach.
• Strong communication and problem-solving skills.

Responsibilities

• Lead MES implementation phases and define equipment workflows.
• Translate shop-floor needs into digital process designs and interlocks.
• Validate equipment integration and lead UAT on production floor.
• Transition to production role to improve uptime and automation.

Skills

MES expertise

Equipment maintenance

Data collection

Team collaboration

Education

Bachelor's degree in Electrical Engineering

Bachelor's degree in Electrical Computer Engineering

Bachelor's degree in Chemical Engineering

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Materials Science Engineering

Tools

ASM

KNS

Job description

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Wire Bond and Die Attach lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1–2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:

• MES Implementation (Project Phase): Represent equipment engineering in the MES rollout. Define equipment-specific workflows, setup/recipe controls, qualification requirements, and equipment states.
• Integration & Data: Translate physical shop-floor requirements into digital process designs. Define data collection needs and equipment interlocks to ensure seamless hardware-to-software communication.
• Validation: Validate equipment integration scenarios and lead User Acceptance Testing (UAT) and deployment on the production floor.
• Sustaining (Post-Project Phase): Transition to a production role to manage equipment reliability, troubleshoot MES-related equipment issues, and leverage your implementation knowledge to drive continuous improvement in automation and uptime.

Minimum Requirements:

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands-on semiconductor equipment experience in Wire Bond and/or Die Attach, with minimum 2 years of relevant experience

Preferred Qualifications:

• Equipment experience with ASM and KNS
• Candidate with MES experiences
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship