Senior Wire Bond Process Innovator

nexperia; Seremban; On-site; MYR 180,000 - 240,000; Full time

Job summary

Nexperia in Malaysia is seeking a Senior Process Development Engineer (WB) to develop and optimize semiconductor assembly processes, ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.

The role requires hands-on FOL process experience (wafer dicing, die bond, plasma, wire bond, AOI), strong wire bond packaging knowledge, and extensive use of DOE/SPC/FMEA/Six Sigma methods to drive data-based decisions.

Qualifications

• Bachelor's degree in engineering or equivalent.
• 5+ years in semiconductor or manufacturing environment.
• Hands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI).
• Strong knowledge of wire bond packaging technologies.
• Experience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D, Minitab/Statistica).
• Strong analytical, problem-solving, and data interpretation skills.
• Good communication skills in fluent English.
• Strong teamwork and ability to work across functions and sites.

Responsibilities

• Develop and characterize new semiconductor process technologies, applying DOE, SPC, FMEA, and Six Sigma.
• Drive end-to-end process development from concept to stable, high-yield manufacturing solutions.
• Provide technical input for assembly processes and equipment solutions for new products and platforms.
• Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites.
• Apply wafer metallization knowledge to optimize process performance and stability.
• Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives.
• Use statistical analysis tools to analyze process performance and drive data-based decisions.
• Provide technical support for wire bond-related issues for internal and external customers.
• Demonstrate technical leadership in cross-site problem solving and process improvement activities.
• Communicate effectively across teams, ensuring clear technical alignment and fast response to manufacturing challenges.

Skills

DOE

SPC

FMEA

Six Sigma

Data interpretation

Problem solving

Fluent English

Education

Bachelor's degree in engineering

Tools

Minitab

Statistica

Job description

Nexperia in Malaysia is seeking a Senior Process Development Engineer (WB) to develop and optimize semiconductor assembly processes, ensuring robust manufacturability, reliability, and high-quality output for new products and platforms.

The role requires hands-on FOL process experience (wafer dicing, die bond, plasma, wire bond, AOI), strong wire bond packaging knowledge, and extensive use of DOE/SPC/FMEA/Six Sigma methods to drive data-based decisions.