Senior Wire Bond Process Sustaining Engineer - Yield Focus

Nexperia; Seremban; On-site; MYR 180,000 - 240,000; Full time

Job summary

Nexperia in Malaysia is seeking a Senior Engineer Wire Bond Process Sustaining to sustain and optimize SOT363 manufacturing processes, ensuring stable production and high quality.

You will collaborate with Production, Quality, Equipment and Product Engineering teams, lead root cause analyses, drive continuous improvement, and support NPI and product transfers in a high-volume, advanced semiconductor environment.

Qualifications

• Bachelor's Degree in Electronics, Electrical, Chemical, Materials, Manufacturing, Mechanical Engineering, or a related discipline.
• Minimum 5 years of experience in semiconductor process engineering or manufacturing engineering.
• Experience in semiconductor assembly processes within a high-volume manufacturing environment.
• Must Have Experience in process sustaining, troubleshooting, and yield improvement.
• Strong knowledge of semiconductor assembly processes and process control methodologies.
• Experience with root cause analysis and problem-solving tools such as 8D, FMEA, and CAPA.
• Proficiency in SPC, DOE, and data analysis techniques.
• Strong analytical skills with the ability to drive process improvements through data-driven decision making.
• Good to Have Experience with SOT363 or similar discrete package technologies.
• Lean Six Sigma Green Belt or Black Belt certification.
• Experience using JMP, Minitab, or equivalent statistical analysis tools.
• Knowledge of reliability testing, failure analysis, and process qualification methodologies.
• Experience supporting NPI, technology transfer, or product ramp-up activities.

Responsibilities

• Sustain and monitor SOT363 manufacturing processes to ensure stable production performance.
• Investigate process deviations, yield losses, and quality issues, and implement effective corrective actions.
• Drive continuous improvement initiatives to enhance yield, quality, productivity, and cost efficiency.
• Analyze process data and identify opportunities for process optimization and robustness improvement.
• Conduct root cause analysis and implement preventive measures to eliminate recurring issues.
• Support process qualifications, validations, and engineering evaluations.
• Collaborate with cross-functional teams to resolve process-related challenges and improve manufacturing performance.
• Develop and maintain process documentation, work instructions, and technical reports.
• Support new product introduction (NPI), product transfer, and change management activities as required.

Skills

Root cause analysis

Data-driven decisions

Process improvement

Troubleshooting

Analytical skills

Education

Bachelor's Degree in Electronics, Electrical, Chemical, Materials, Manufacturing, Mechanical Engineering, or related

Tools

JMP

Minitab

Job description

Nexperia in Malaysia is seeking a Senior Engineer Wire Bond Process Sustaining to sustain and optimize SOT363 manufacturing processes, ensuring stable production and high quality.

You will collaborate with Production, Quality, Equipment and Product Engineering teams, lead root cause analyses, drive continuous improvement, and support NPI and product transfers in a high-volume, advanced semiconductor environment.