Die/Wire Bond Process Engineer for Yield & Optimization

Renesas Electronics; Bayan Lepas; On-site; MYR 78,000 - 134,000; Full time

Job summary

Renesas Electronics seeks a Process Engineer in Penang to lead die bond and wire bond processes, optimize yield, and troubleshoot production issues. The candidate will support NPI, process qualification, and transfer to mass production with a focus on stable, high-quality manufacturing performance.

The role requires a solid foundation in back-end equipment and materials, data analysis skills, and collaboration with cross-functional teams. A Bachelor's degree in Engineering is essential.

Qualifications

• Bachelor’s degree in Engineering (Materials, Mechanical, or related field).
• Minimum 2 years of experience in semiconductor back-end assembly.
• Strong knowledge of die bonding and wire bonding processes.
• Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires.
• Experience with process characterization, DOE, and data analysis is an advantage.
• Good problem-solving, communication, and teamwork skills.

Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
• Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability

Skills

Data analysis

DOE

Problem solving

Communication

Teamwork

Statistical methods

Education

Bachelor’s degree in Engineering (Materials, Mechanical, or related field)

Job description

Renesas Electronics seeks a Process Engineer in Penang to lead die bond and wire bond processes, optimize yield, and troubleshoot production issues. The candidate will support NPI, process qualification, and transfer to mass production with a focus on stable, high-quality manufacturing performance.

The role requires a solid foundation in back-end equipment and materials, data analysis skills, and collaboration with cross-functional teams. A Bachelor's degree in Engineering is essential.