Senior Wire Bond Process Engineer for Mass Production

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Bayan Lepas; On-site; MYR 78,000 - 123,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Wire Bond Process Development Senior Engineer to design and implement the Wire Bond process for mass production, coordinating with the operations team to meet project timelines.

You will support the technology roadmap, assist in pre-series and ramp-up of new products, and address post Q5 quality, yield, and FAR concerns, applying solid statistics and process development methods.

Qualifications

• Bachelor or Master degree in engineering or relevant field.
• 2–5 years in semiconductor DA & WB process engineering field.
• DA & WB process engineering knowledge & hands on skillset in semiconductors or LED manufacturing processes.
• Knowledge in process development steps and statistics.

Responsibilities

• Develop Wire Bond process for mass production to handshake with operation team per project targeted timeline.
• Support and contribute in Wire Bond technology building block / roadmap.
• Support new product pre-series and ramp-up.
• Support post Q5 product quality, yield and FAR topics.

Skills

Wire Bond

Process development

Statistical methods

Semiconductor manufacturing

Education

Bachelor or Master degree in engineering or relevant field

Job description

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Wire Bond Process Development Senior Engineer to design and implement the Wire Bond process for mass production, coordinating with the operations team to meet project timelines.

You will support the technology roadmap, assist in pre-series and ramp-up of new products, and address post Q5 quality, yield, and FAR concerns, applying solid statistics and process development methods.