Wire Bond Equipment Engineer II - Reliability & Optimization

MY61 Nexperia Malaysia; Seremban; Sur place; MYR 78 000 - 100 000; Plein temps

Résumé du poste

Nexperia Malaysia is seeking an Engineer II within the RTR Engineering team to support high-volume semiconductor manufacturing operations by driving Wire Bond equipment performance, reliability, and continuous improvement initiatives. You will collaborate with Production, Process, Quality, Manufacturing, and Maintenance teams to ensure operational excellence.

In this role you will troubleshoot and resolve Wire Bond equipment issues, drive preventive maintenance improvements, support equipment

Qualifications

• Bachelor's degree in relevant engineering field.
• 2–5 years of semiconductor manufacturing experience.
• Experience supporting Wire Bond equipment in production.

Responsabilités

• Troubleshoot Wire Bond equipment issues to minimize downtime.
• Drive equipment reliability and preventive maintenance improvements.
• Support equipment qualification, validation, installation, and production ramp activities.
• Analyze OEE, yield, and downtime data to identify improvements.
• Lead equipment optimization, productivity, and cost reduction projects.
• Ensure safety, quality, and manufacturing standards compliance.

Connaissances

Wire Bond troubleshooting

Root cause analysis

Preventive maintenance

Equipment reliability

Production support

OEE monitoring

MTBF/MTTR knowledge

Yield monitoring

Strong analytical skills

Communication skills

Independence at work

Formation

Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering, or equivalent

Outils

ASM

K&S

Shinkawa

Hesse

Wire Bond platforms

Description du poste

Nexperia Malaysia is seeking an Engineer II within the RTR Engineering team to support high-volume semiconductor manufacturing operations by driving Wire Bond equipment performance, reliability, and continuous improvement initiatives. You will collaborate with Production, Process, Quality, Manufacturing, and Maintenance teams to ensure operational excellence.

In this role you will troubleshoot and resolve Wire Bond equipment issues, drive preventive maintenance improvements, support equipment