Senior Wire Bond Process Engineer – Shape Next-Gen Tech

Infineon Technologies; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

Infineon Technologies in Malaysia is seeking a Staff Engineer for Unit Process Development Wire Bond to drive advanced packaging processes. You will lead development activities, optimize wire bond steps, and ensure robust, manufacturable solutions across product lines.

The role requires hands-on expertise with ASM and Shinkawa equipment, strong problem-solving skills, and experience with DMAIC, FMEA, DOE, and statistical analysis to support new product introductions and process improvements.

Qualifications

• Master’s or Bachelor’s Degree in Engineering or related discipline
• >5 years of experience in semiconductor manufacturing, preferably in assembly process development
• Hands-on experience in wire bond processes including ASM and Shinkawa equipment
• Proven problem-solving and root cause analysis using DMAIC, 8D, FMEA, and statistics
• Knowledge of analytical and failure analysis techniques with data interpretation
• Proficiency in DOE, process capability, and statistical data analysis
• Strong communication and collaboration across cross-functional and global teams

Responsibilities

• Serve as unit process expert in development projects, supporting milestones through process development, characterization, tooling design reviews, and equipment release activities
• Lead qualification and verification of new materials, tooling, and equipment for new product introductions and technology deployments
• Support prototype and customer sample builds, drive process optimization, troubleshooting, and risk mitigation
• Own and maintain process documentation (PFDs, PFMEA, DFMEA, OJTI, T32, PDR)
• Ensure effective handover to Operations for manufacturing readiness and sustaining production
• Collaborate with cross-functional teams and suppliers to deliver robust, cost-effective process solutions

Job description

Infineon Technologies in Malaysia is seeking a Staff Engineer for Unit Process Development Wire Bond to drive advanced packaging processes. You will lead development activities, optimize wire bond steps, and ensure robust, manufacturable solutions across product lines.

The role requires hands-on expertise with ASM and Shinkawa equipment, strong problem-solving skills, and experience with DMAIC, FMEA, DOE, and statistical analysis to support new product introductions and process improvements.