Senior Wire Bond Process Innovation Engineer

Accion Labs; Petaling Jaya; On-site; MYR 120,000 - 180,000; Full time

Job summary

Accion Labs is seeking an experienced Senior Wire Bond Process Development Engineer to lead development, optimization and release of wire bond processes for advanced semiconductor packages. The role requires strong copper wire ball bonding expertise and work across global assembly sites.

The engineer will drive DOE-driven process windows, pursue statistical engineering methods, and contribute to IP generation while supporting manufacturing readiness and AI-enabled engineering initiatives.

Qualifications

• Bachelor's Degree in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Electrical Engineering, Semiconductor Engineering or related disciplines.
• Minimum 5 years of semiconductor assembly experience with direct responsibility for wire bond process development.
• Hands-on experience with K&S wire bonding platforms.
• Strong copper wire ball bonding process development experience.
• Experience leading development projects from initiation through production release.
• Knowledge of DOE, Six Sigma, SPC, APQP, DFMEA, PFMEA, Control Plans, and risk management.
• Familiarity with JMP or equivalent statistical software tools.

Responsibilities

• Lead wire bond process development projects from concept through qualification and production release.
• Establish robust process windows through DOE, statistical analysis and process characterization.
• Develop and optimize first bond, second bond and looping processes for advanced packaging applications.
• Characterize and qualify new wafer technologies, bond pad structures, substrates, leadframes and assembly materials.
• Define process specifications, process limits and manufacturing control strategies.
• Evaluate and introduce new wire bonding technologies, materials and equipment capabilities.
• Knowledge in Wire Bond AOI process will be an added advantage.
• Collaborate with global cross-functional teams to ensure successful implementation.

Skills

Wire bond process development

Statistical engineering

DOE

Six Sigma

Project leadership

Cross-functional collaboration

Education

Bachelor's degree in Mechanical/Materials/Manufacturing/Electronics/Electrical/Semiconductor Engineering or related

Tools

K&S wire bonding platforms

Wire bond AOI

JMP

Job description

Accion Labs is seeking an experienced Senior Wire Bond Process Development Engineer to lead development, optimization and release of wire bond processes for advanced semiconductor packages. The role requires strong copper wire ball bonding expertise and work across global assembly sites.

The engineer will drive DOE-driven process windows, pursue statistical engineering methods, and contribute to IP generation while supporting manufacturing readiness and AI-enabled engineering initiatives.