COB Wire Bond Engineer

PCL INTERNATIONAL TECHNOLOGIES (PENANG) SDN. BHD.; Batu Kawan; On-site; MYR 120,000 - 180,000; Full time

Job summary

PCL International Technologies (Penang) Sdn. Bhd. is seeking a Senior Wire Bonding Engineer to drive advanced wire bonding activities within semiconductor assembly.

The role demands a minimum of 5 years’ experience with wire bonding, ball and wedge bonding, and solid knowledge of DOE, SPC and FMEA. You will collaborate with cross‑functional teams to optimize processes, improve yield and ensure quality. Responsibilities include process setup, qualification, validation, troubleshooting, reporting,

Qualifications

• Bachelor’s degree in an engineering discipline.
• Minimum 5 years in semiconductor assembly or wire bonding.
• Hands-on experience with ball and wedge bonding, process setup and troubleshooting.
• Knowledge of wire materials and process parameters.
• Experience with bond quality and reliability evaluations.
• Strong analytical and problem solving skills.
• Familiarity with DOE, SPC and FMEA.
• Ability to lead projects and communicate across teams.

Responsibilities

• Develop and optimize wire bonding processes and parameters for stability and yield.
• Perform setup, qualification, validation and optimization for new/existing processes.
• Troubleshoot issues such as non-stick defects, bond lift and loop problems.
• Conduct DOE and statistical analyses to define robust process windows.
• Prepare technical reports and present findings to management.
• Support audits and technical discussions related to wire bonding.
• Keep abreast of new wire bonding technologies and materials.
• Travel as required for supplier/customer support and projects.

Skills

Wire bonding

Ball bonding

Wedge bonding

DOE

SPC

FMEA

Analytical skills

Project leadership

Education

Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing Engineering or related

Job description

Job Position/Title: Senior Wire Bonding Engineer

* Bachelor's Degree in Mechanical, Electrical, Electronics, Manufacturing Engineering or a related engineering discipline.

* Minimum 5 years of relevant experience in semiconductor assembly, wire bonding or advanced packaging engineering, preferably handling wre bonding (K&S & Kaijo) would be advantage.

* Strong hands-on experience with wire bonding processes, including ball bonding and/or wedge bonding, process setup, optimization and troubleshooting.

* Good knowledge of wire bonding materials and process parameters, including wire, capillary/wedge tools, bond force, ultrasonic energy. bonding time, temperature and loop parameters.

* Experience with bond quality requirements and reliability evaluations, including bond pull, wire pull, ball shear, bond deformation and visual inspection criteria.

* Strong analytical and problem-solving skills, with the ability to identify root causes and implement effective corrective and preventive actions.

* Knowledge of DOE, SPC, process capability analysis, FMEA and other structured engineering problem-solving methodologies.

* Ability to lead engineering projects, communicate effectively with cross-functional teams and work independently with limited supervision.

Report to : Level 1: Engineering Head Of Department

Job Responsibilities:

* Develop, establish and optimize wire bonding processes and parameters to achieve stable process performance, high yield, quality and productivity.

* Perform process setup, qualification, validation and optimization for new and existing wire bonding processes, products, materials and equipment.

* Troubleshoot wire bonding issues such as non-stick on pad, non-stick on lead, wire breakage, heel crack, bond lift, insufficient bond strength, ball deformation, stitch deformation and loop-related defects.

* Conduct DOE and statistical analysis to determine critical process parameters and enstablish robust process windows.

*Prepare engineering reports, DOE reports, qualification reports, process capability studies and presentations for management and cross-functional reviews.

*Support customer audits, internal audits and technical discussions related to wire bonding processes when required.

* Maintain awareness of emerging wire bonding technologies, materials, and equipment and industry practices and recommend improvements where applicable.

*Perform any other duties and assignments as and when required by Superior from time to time.

* Ability to work under pressure, manage multiple priorities and meet project and production deadlines with limited supervision.

* Travel outstation or overseas for job requirements, supplier support, customer support, training or technical projects when required.

*Authorities: NIL