Wire Bond Process Development Engineer

AccionLabs Sdn Bhd; Petaling Jaya; On-site; MYR 90,000 - 180,000; Full time

Job summary

AccionLabs Sdn Bhd in Malaysia seeks a Senior Wire Bond Process Development Engineer to lead development, optimization and release of wire bond processes for semiconductor packages. You will establish DOE-driven process windows, drive qualification, and collaborate with global assembly teams to enable ramp and manufacturing readiness.

The role emphasizes advancement of copper wire ball bonding, process characterization, and adoption of AI-enabled engineering methods, with exposure to patent

Qualifications

• Bachelor's degree in engineering or related discipline as listed.
• Minimum 5 years of semiconductor assembly experience with wire bond development.
• Hands-on experience with K&S wire bonding platforms.
• Strong knowledge of DOE, Six Sigma, SPC, and risk management.
• Experience with JMP or equivalent statistical software.

Responsibilities

• Lead development, optimization, qualification and release of wire bond processes for new products.
• Establish robust process windows via DOE, statistical analysis and characterization.
• Develop and optimize first/second bond and looping processes for advanced packaging.
• Characterize and qualify new wafer technologies, bond pads and substrates.
• Define process specs, limits and manufacturing control strategies.
• Evaluate and introduce new wire bonding technologies and equipment capabilities.
• Lead projects from concept through production release with cross-functional teams.
• Apply Six Sigma methodologies to process development and optimization.

Skills

Wire bond process development

DOE

Six Sigma

SPC

Statistical analysis

Root Cause Analysis

JMP

Project leadership

Education

Bachelor's Degree in Mechanical Engineering

Tools

K&S wire bonding platforms

Job description

We are seeking an experienced and highly motivated Senior Wire Bond Process Development Engineer to join our global Assembly Process Innovation team. The successful candidate will be responsible for developing, optimizing, qualifying and releasing advanced wire bond processes for semiconductor packages. This role requires strong expertise in copper wire ball bonding, process characterization, statistical engineering methodologies, automotive quality requirements and technology innovation.

The engineer will lead wire bond process development projects, support qualification of new packages and technology roadmap execution, collaborate with global assembly sites, and drive improvements in process capability, quality, reliability and manufacturing readiness. The candidate is also expected to contribute to invention disclosures, patent generation and the adoption of AI-enabled engineering methodologies.

Key responsibilities

Lead development, optimization, qualification and release of wire bond processes for new semiconductor products, package platforms and wafer technologies

Establish robust process windows through Design of Experiments (DOE), statistical analysis and process characterization

Develop and optimize first bond, second bond and looping processes for advanced packaging applications

Characterize and qualify new wafer technologies, bond pad structures, substrates, leadframes and assembly materials

Define process specifications, process limits and manufacturing control strategies

Evaluate and introduce new wire bonding technologies, materials and equipment capabilities

Lead individual wire bond process development projects from concept through qualification and production release

Define project objectives, technical deliverables, timelines, risks and mitigation plans

Coordinate activities with global cross-functional teams from product, assembly and test

Apply Six Sigma methodologies to process development and optimization activities

About you

Bachelor's Degree in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Electrical Engineering, Semiconductor Engineering or related disciplines

Minimum 5 years of semiconductor assembly experience with direct responsibility for wire bond process development

Proven hands-on experience with K&S wire bonding platforms

Strong experience in copper wire ball bonding process development

Demonstrated experience leading development projects from initiation through production release

Strong knowledge of Design of Experiments (DOE), Six Sigma methodologies, Statistical Process Control (SPC), Process Capability Analysis, APQP, DFMEA, PFMEA, Control Plans, Risk Management, Root Cause Analysis and Structured Problem Solving

Experience utilizing JMP or equivalent statistical software tools

Excellent analytical, technical communication and project leadership skills

Ability to work effectively within global cross-functional teams