Senior Wire Bond Process Development Engineer

Nexperia; Seremban; Hybrid; MYR 120,000 - 180,000; Full time

Job summary

Nexperia in Seremban, Malaysia, seeks a Sr Wirebond Process Development Engineer to develop and optimize semiconductor assembly processes. You will drive end-to-end development from concept to high-yield manufacturing, providing technical inputs for new products and leading discussions across teams.

The role requires 5+ years in semiconductor/manufacturing, strong wire bond packaging knowledge, and expertise with Six Sigma and statistical tools to guide data-driven improvements.

Qualifications

• Bachelor’s degree in engineering or related field.
• Minimum 5 years in semiconductor/manufacturing environment.
• Hands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI).
• Strong knowledge of wire bond packaging technologies.
• Experience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D).
• Strong analytical and problem-solving abilities; data interpretation skills.
• Excellent English communication and cross-functional collaboration abilities.

Responsibilities

• Develop and optimize semiconductor assembly processes to meet FRS.
• Lead end-to-end process development from concept to high-yield manufacturing.
• Provide technical input for assembly processes and equipment for new products.
• Lead technical discussions on wire bond and FOL processes across teams and sites.
• Apply wafer metallization knowledge to improve process stability.
• Conduct benchmarking and technology studies for roadmap and improvements.
• Use statistical tools to analyze process performance and drive decisions.
• Offer technical support for wire bond issues to internal and external customers.
• Demonstrate cross-site leadership in problem solving and improvements.

Skills

Wire bond tech

Six Sigma

DOE analysis

Problem solving

Communication

Cross-functional teamwork

Data interpretation

Fluent English

Education

Bachelor’s degree in engineering

Tools

Minitab

Statistica

Job description

Nexperia in Seremban, Malaysia, seeks a Sr Wirebond Process Development Engineer to develop and optimize semiconductor assembly processes. You will drive end-to-end development from concept to high-yield manufacturing, providing technical inputs for new products and leading discussions across teams.

The role requires 5+ years in semiconductor/manufacturing, strong wire bond packaging knowledge, and expertise with Six Sigma and statistical tools to guide data-driven improvements.