Senior Wire Bond Process Development Engineer

Accion Labs; Petaling Jaya; On-site; MYR 120,000 - 180,000; Full time

Job summary

Accion Labs is seeking an experienced Senior Wire Bond Process Development Engineer to lead development, optimization and release of wire bond processes for advanced semiconductor packages. The role requires strong copper wire ball bonding expertise and work across global assembly sites.

The engineer will drive DOE-driven process windows, pursue statistical engineering methods, and contribute to IP generation while supporting manufacturing readiness and AI-enabled engineering initiatives.

Qualifications

• Bachelor's Degree in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Electrical Engineering, Semiconductor Engineering or related disciplines.
• Minimum 5 years of semiconductor assembly experience with direct responsibility for wire bond process development.
• Hands-on experience with K&S wire bonding platforms.
• Strong copper wire ball bonding process development experience.
• Experience leading development projects from initiation through production release.
• Knowledge of DOE, Six Sigma, SPC, APQP, DFMEA, PFMEA, Control Plans, and risk management.
• Familiarity with JMP or equivalent statistical software tools.

Responsibilities

• Lead wire bond process development projects from concept through qualification and production release.
• Establish robust process windows through DOE, statistical analysis and process characterization.
• Develop and optimize first bond, second bond and looping processes for advanced packaging applications.
• Characterize and qualify new wafer technologies, bond pad structures, substrates, leadframes and assembly materials.
• Define process specifications, process limits and manufacturing control strategies.
• Evaluate and introduce new wire bonding technologies, materials and equipment capabilities.
• Knowledge in Wire Bond AOI process will be an added advantage.
• Collaborate with global cross-functional teams to ensure successful implementation.

Skills

Wire bond process development

Statistical engineering

DOE

Six Sigma

Project leadership

Cross-functional collaboration

Education

Bachelor's degree in Mechanical/Materials/Manufacturing/Electronics/Electrical/Semiconductor Engineering or related

Tools

K&S wire bonding platforms

Wire bond AOI

JMP

Job description

We are seeking an experienced and highly motivated Senior Wire Bond Process Development Engineer to join our global Assembly Process Innovation team.

The successful candidate will be responsible for developing, optimizing, qualifying and releasing advanced wire bond processes for semiconductor packages. This role requires strong expertise in copper wire ball bonding, process characterization, statistical engineering methodologies, automotive quality requirements and technology innovation.

The engineer will lead wire bond process development projects, support qualification of new packages and technology roadmap execution, collaborate with global assembly sites, and drive improvements in process capability, quality, reliability and manufacturing readiness. The candidate is also expected to contribute to invention disclosures, patent generation and the adoption of AI-enabled engineering methodologies.

Responsibilities

Wire Bond Process Development

• Lead development, optimization, qualification and release of wire bond processes for new semiconductor products, package platforms and wafer technologies.


• Establish robust process windows through Design of Experiments (DOE), statistical analysis and process characterization.


• Develop and optimize first bond, second bond and looping processes for advanced packaging applications.


• Characterize and qualify new wafer technologies, bond pad structures, substrates, leadframes and assembly materials.


• Define process specifications, process limits and manufacturing control strategies.


• Evaluate and introduce new wire bonding technologies, materials and equipment capabilities.


• Knowledge in Wire Bond Automated Optical Inspection process will be an added advantage.

Project Leadership

• Lead individual wire bond process development projects from concept through qualification and production release.


• Define project objectives, technical deliverables, timelines, risks and mitigation plans.


• Drive project execution and achievement of development milestones.


• Coordinate activities with global cross-functional teams from product, assembly and test.


• Present project updates, technical conclusions and recommendations to stakeholders and management.


• Support development of future wire bond technology roadmaps.

Quality, APQP & Risk Management

• Apply Six Sigma methodologies to process development and optimization activities.


• Utilize advanced statistical tools to identify process interactions and optimize process performance.


• Lead Advanced Product Quality Planning (APQP) activities throughout the product development lifecycle.


• Develop and maintain:
  
  
  • Design Failure Mode and Effects Analysis (DFMEA)
  
  
  • Process Failure Mode and Effects Analysis (PFMEA)
  
  
  • Control Plans
  
  
  • Statistical Process Control (SPC) strategies
  
  
  • Process qualification plans and reports
  
  
  • Process capability studies
  
  
  • Risk assessments
  
  


• Ensure compliance with internal quality systems and automotive customer requirements.


• Drive root cause analysis and corrective actions using structured methodologies such as DMAIC, 8D and statistical problem-solving techniques.


• Support process audits, qualification reviews and risk assessments.

Manufacturing & Technology Transfer

• Support deployment and transfer of developed processes to internal assembly manufacturing sites.


• Collaborate with ATKL, ATBK, ATKH, ATTJ and other internal assembly organizations to ensure successful implementation.


• Drive process standardization and sharing of best practices across sites.


• Partner with equipment suppliers and material vendors to improve process capability and manufacturing robustness.

Data Analytics & AI Enablement

• Utilize JMP or other equivalent advanced statistical software for data analysis, process optimization and predictive assessments.


• Analyze large manufacturing datasets to drive process understanding and continuous improvement.


• Leverage AI-enabled engineering tools to improve productivity, technical problem solving and knowledge discovery.


• Support digitalization and data-driven decision-making initiatives.

Innovation & Intellectual Property

• Generate innovative technical solutions to address future packaging and wire bond challenges.


• Contribute to invention disclosures, patent generation and intellectual property development.


• Participate in technical publications, innovation programs and technology benchmarking activities.


• Maintain awareness of industry trends, emerging technologies and competitor developments.


• Contribute to strategic technology roadmap planning.

Qualifications

• Bachelor's Degree in Mechanical Engineering, Materials Engineering, Manufacturing Engineering, Electronics Engineering, Electrical Engineering, Semiconductor Engineering or related disciplines.


• Minimum 5 years of semiconductor assembly experience with direct responsibility for wire bond process development.


• Proven hands‑on experience with K&S wire bonding platforms.


• Strong experience in copper wire ball bonding process development.


• Knowledge in wire bond automated optical inspection will be an added advantage.


• Demonstrated experience leading development projects from initiation through production release.


• Strong knowledge of:
  
  
  • Design of Experiments (DOE)
  
  
  • Six Sigma methodologies
  
  
  • Statistical Process Control (SPC)
  
  
  • Process Capability Analysis
  
  
  • APQP
  
  
  • DFMEA
  
  
  • PFMEA
  
  
  • Control Plans
  
  
  • Risk Management
  
  
  • Root Cause Analysis
  
  
  • Structured Problem Solving
  
  
  • Experience utilizing JMP or equivalent statistical software tools.
  
  


• Excellent analytical, technical communication and project leadership skills.


• Ability to work effectively within global cross-functional teams.

Key Competencies

Technical Competencies

• Wire Bond Process Development


• Copper Wire Ball Bonding


• DOE & Statistical Analysis


• JMP Data Analytics


• Process Qualification


• Reliability Engineering


• Failure Analysis


• AOI Methodology


• Process Control & Optimization


• APQP, DFMEA & PFMEA

Leadership Competencies

• Technical Project Leadership


• Innovation & Creativity


• Strategic Thinking


• Stakeholder Management


• Cross-Functional Collaboration


• Problem Solving


• Results Orientation


• Effective Technical Communication