Process Engineer - Die & Wire Bonding (Semiconductor)

Renesas Electronics Corporation; Kuala Lumpur; On-site; MYR 60,000 - 90,000; Full time

Job summary

Renesas Electronics Corporation in Malaysia is seeking a Process Engineer with at least 2 years of hands-on experience in semiconductor back-end assembly, focusing on die bonding and wire bonding.

The role centers on process setup, optimization, yield improvement, and troubleshooting to ensure stable, high-quality manufacturing performance. You will analyze data, drive continuous improvement, and support production operations across cross-functional teams.

Qualifications

• Bachelor’s degree in Engineering (Materials, Mechanical, or related field).
• Minimum 2 years of experience in semiconductor back-end assembly
• Strong knowledge of die bonding and wire bonding processes
• Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires
• Experience with process characterization, DOE, and data analysis is an advantage
• Good problem-solving, communication, and teamwork skills.

Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
• Collaborate with cross‑functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability

Skills

Problem-solving

Teamwork

Communication

Data analysis

Education

Bachelor’s degree in Engineering (Materials, Mechanical, or related field)

Tools

DOE

SPC

CPK

Job description

Renesas Electronics Corporation in Malaysia is seeking a Process Engineer with at least 2 years of hands-on experience in semiconductor back-end assembly, focusing on die bonding and wire bonding.

The role centers on process setup, optimization, yield improvement, and troubleshooting to ensure stable, high-quality manufacturing performance. You will analyze data, drive continuous improvement, and support production operations across cross-functional teams.