Sr Wirebond Process Development Engineer

Nexperia; Seremban; Hybrid; MYR 120,000 - 180,000; Full time

Job summary

Nexperia in Seremban, Malaysia, seeks a Sr Wirebond Process Development Engineer to develop and optimize semiconductor assembly processes. You will drive end-to-end development from concept to high-yield manufacturing, providing technical inputs for new products and leading discussions across teams.

The role requires 5+ years in semiconductor/manufacturing, strong wire bond packaging knowledge, and expertise with Six Sigma and statistical tools to guide data-driven improvements.

Qualifications

• Bachelor’s degree in engineering or related field.
• Minimum 5 years in semiconductor/manufacturing environment.
• Hands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI).
• Strong knowledge of wire bond packaging technologies.
• Experience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D).
• Strong analytical and problem-solving abilities; data interpretation skills.
• Excellent English communication and cross-functional collaboration abilities.

Responsibilities

• Develop and optimize semiconductor assembly processes to meet FRS.
• Lead end-to-end process development from concept to high-yield manufacturing.
• Provide technical input for assembly processes and equipment for new products.
• Lead technical discussions on wire bond and FOL processes across teams and sites.
• Apply wafer metallization knowledge to improve process stability.
• Conduct benchmarking and technology studies for roadmap and improvements.
• Use statistical tools to analyze process performance and drive decisions.
• Offer technical support for wire bond issues to internal and external customers.
• Demonstrate cross-site leadership in problem solving and improvements.

Skills

Wire bond tech

Six Sigma

DOE analysis

Problem solving

Communication

Cross-functional teamwork

Data interpretation

Fluent English

Education

Bachelor’s degree in engineering

Tools

Minitab

Statistica

Job description

## Sr Wirebond Process Development Engineer申请: Seremban: Full time: 今天发布: R-20015698As a Sr Process Development Engineer (WB), you will develop and optimize semiconductor assembly processes to meet project Functional Requirement Specifications (FRS), ensuring robust manufacturability, reliability, and high-quality output for new products and platforms. **What You Will Do*** Develop and characterize new semiconductor process technologies, applying structured engineering methods such as DOE, SPC, FMEA, and Six Sigma* Drive end-to-end process development from concept to stable, high-yield manufacturing solutions* Provide technical input for assembly processes and equipment solutions for new products and platforms* Lead technical discussions and troubleshooting on wire bond and related FOL processes across project teams and sites* Apply wafer metallization knowledge to optimize process performance and stability* Conduct benchmarking and technology studies to support package roadmap and continuous improvement initiatives* Use statistical analysis tools (e.g. Minitab/Statistica) to analyze process performance and drive data-based decisions* Provide technical support for wire bond-related issues for both internal and external customers* Demonstrate technical leadership in cross-site problem solving and process improvement activities* Communicate effectively across teams, ensuring clear technical alignment and fast response to manufacturing challenges **What You Will Need*** Bachelor’s degree in engineering or an equivalent related field of study* At least 5 years of experience in semiconductor or manufacturing environment* Hands-on experience in FOL processes (wafer dicing, die bond, plasma, wire bond, AOI)* Strong knowledge of wire bond packaging technologies* Experience applying Six Sigma methodologies and statistical tools (DOE, SPC, FMEA, 8D, Minitab/Statistica)* Strong analytical, problem-solving, and data interpretation skills* Good communication skills in fluent English* Strong teamwork, interpersonal skills, and ability to work across functions and sites* Strong ownership, responsiveness, and ability to handle customer or production issues effectively