Senior Equipment Engineer: Die/Wire Bond Reliability

Nexperia

Seremban

On-site

MYR 120,000 - 180,000

Full time

14 days+

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Nexperia in Seremban is seeking a Senior Engineer to lead restoration and major overhauls for Die Bond, Wire Bond, and Buffer equipment. The role focuses on uptime, reliability, and continuous improvement while guiding floor technicians and coordinating with cross-functional teams.

You will apply RCA/PM practices, plan spare parts, and collaborate with vendors to implement improvements in a high-availability semiconductor assembly line.

Qualifications

  • Bachelor's degree in engineering or related field; 5–8 years in semiconductor equipment maintenance.
  • Experience with Die Bond, Wire Bond, and Buffer equipment.
  • Strong troubleshooting, RCAs, and maintenance planning.

Responsibilities

  • Lead equipment restoration, repair, and recovery for Die Bond, Wire Bond, and Buffer equipment.
  • Drive uptime improvement and reliability initiatives to meet production goals.
  • Perform RCA on chronic equipment issues and implement corrective actions.
  • Develop and optimize preventive and predictive maintenance programs.
  • Plan overhauls, refurbishments, upgrades, and spare parts strategies.
  • Collaborate with cross-functional teams and mentor technicians.

Skills

Semiconductor equipment maintenance
Root cause analysis
Preventive maintenance
Troubleshooting
Project management
Cross-functional collaboration

Education

Bachelor's Degree in Electrical Engineering
Bachelor's Degree in Mechanical Engineering

Tools

Preventive maintenance software
FMEA tools
DOE

Job description

Nexperia in Seremban is seeking a Senior Engineer to lead restoration and major overhauls for Die Bond, Wire Bond, and Buffer equipment. The role focuses on uptime, reliability, and continuous improvement while guiding floor technicians and coordinating with cross-functional teams.

You will apply RCA/PM practices, plan spare parts, and collaborate with vendors to implement improvements in a high-availability semiconductor assembly line.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior Wire Bond Equipment Reliability Lead
Senior Wire Bond Equipment Reliability Lead

Nexperia • Seremban

On-site
MYR 200,000 - 260,000
Wire Bond Maintenance Lead — Uptime & Reliability
Wire Bond Maintenance Lead — Uptime & Reliability

Nexperia • Seremban

On-site
MYR 180,000 - 240,000
Senior Engineer
Senior Engineer

Nexperia • Seremban

On-site
MYR 120,000 - 180,000
Senior Wire Bond Process Sustaining Engineer - Yield Focus
Senior Wire Bond Process Sustaining Engineer - Yield Focus

Nexperia • Seremban

On-site
MYR 180,000 - 240,000
Senior Equipment Engineer - Semiconductor Manufacturing Lead
Senior Equipment Engineer - Semiconductor Manufacturing Lead

Carsem (M) Sdn. Bhd • Ipoh

On-site
MYR 120,000 - 180,000
Medical
Education support
Dental
+3
Senior Die Attach/DACA Equipment Sustaining Engineer
Senior Die Attach/DACA Equipment Sustaining Engineer

Nexperia • Seremban

On-site
MYR 120,000 - 180,000
Die/Wire Bond Process Engineer for Yield & Optimization
Die/Wire Bond Process Engineer for Yield & Optimization

Renesas Electronics • Bayan Lepas

On-site
MYR 78,000 - 134,000
Process Engineer - Die & Wire Bonding (Semiconductor)
Process Engineer - Die & Wire Bonding (Semiconductor)

Renesas Electronics Corporation • Kuala Lumpur

On-site
MYR 60,000 - 90,000
Principal Equipment Engineer - Wire Bond & Maintenance Lead
Principal Equipment Engineer - Wire Bond & Maintenance Lead

Infineon Technologies AG • Malacca City

On-site
MYR 180,000 - 300,000
Senior Front-End Process Engineering Leader
Senior Front-End Process Engineering Leader

Nexperia • Seremban

On-site
MYR 180,000 - 300,000