Senior Wire Bond Equipment Reliability Lead

Nexperia; Seremban; On-site; MYR 200,000 - 260,000; Full time

Job summary

Nexperia in Malaysia is seeking a Senior Engineer – P3C Wire Bond Equipment Sustaining to ensure stability and performance of Wire Bond tooling in the P3C area. You will provide technical support to production, drive uptime, and lead improvements for reliability and quality.

The role requires hands-on Wire Bond sustaining experience, strong maintenance knowledge, and collaboration with cross-functional teams to resolve technical issues and execute root-cause analysis for recurring problems.

Qualifications

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or related Engineering.
• Minimum 5 years of experience in semiconductor equipment engineering.
• Experience supporting Wire Bond equipment in a high-volume manufacturing environment.
• Hands-on experience in Wire Bond equipment sustaining and troubleshooting.
• Strong knowledge of equipment maintenance and reliability engineering principles.

Responsibilities

• Sustain and maintain Wire Bond equipment to meet production, quality, and reliability targets.
• Troubleshoot equipment failures and lead root cause analysis to prevent recurrence.
• Drive preventive, predictive, and corrective maintenance activities to maximize equipment uptime.
• Monitor and improve equipment performance metrics such as OEE, MTBF, and MTTR.
• Support equipment qualification, validation, and release for production.
• Work with Production, Process Engineering, Quality, and Maintenance teams to resolve issues.
• Lead equipment performance improvement initiatives to enhance productivity and reduce downtime.
• Collaborate with equipment suppliers on technical support, troubleshooting, and upgrades.
• Prepare and maintain equipment procedures, documentation, and technical reports.

Skills

Root cause analysis

Continuous improvement

Data analysis

Maintenance & reliability principles

Education

Bachelor's degree in Mechanical, Electrical, Electronics, Mechatronics, or related Engineering

Tools

SPC software

8D problem solving

CAPA processes

FMEA processes

Minitab

JMP

Job description

Nexperia in Malaysia is seeking a Senior Engineer – P3C Wire Bond Equipment Sustaining to ensure stability and performance of Wire Bond tooling in the P3C area. You will provide technical support to production, drive uptime, and lead improvements for reliability and quality.

The role requires hands-on Wire Bond sustaining experience, strong maintenance knowledge, and collaboration with cross-functional teams to resolve technical issues and execute root-cause analysis for recurring problems.