Principal Equipment Engineer - Wire Bond & Maintenance Lead

Infineon Technologies AG

Malacca City

On-site

MYR 180,000 - 300,000

Full time

14 days+

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Job summary

Infineon Technologies AG in Malaysia is seeking a Principal Engineer Equipment Engineering to lead a technical team, define comprehensive maintenance, and drive reliability across wire bond equipment. You will implement governance, ensure high availability, and guide cross‑functional projects to successful outcomes.

The role requires deep 8D/DMAIC expertise, strong leadership, and the ability to mitigate risk early while delivering on budget and safety targets.

Qualifications

Bachelor's or Master's degree in Mechanical, Electronics or Automation Engineering.
At least 8 years of experience in the semiconductor industry (wire bond process).
Deep knowledge of 8D and DMAIC problem‑solving methodologies.
Ability to detect and mitigate risk early and lead cross‑functional projects.

Responsibilities

Drive and lead a technical team to define planned maintenance and robust preventive measures.
Gather and apply insights from maintenance improvements to reach optimal machine performance early.
Set and implement governance for wire bond equipment including indicators and monitoring.
Establish planned maintenance systems to ensure safe, high‑availability equipment within budget.
Implement systematic equipment improvements, preventive maintenance, calibration, and countermeasures to prevent breakdowns.
Serve as Equipment Governance owner from concept to sustainment across departments.
Monitor equipment stability by integrating with APC tools or semi‑auto integration systems.
Execute equipment improvements to meet/exceed target results and develop competency in engineers and technicians.