Senior Front-End Process Engineering Leader

Nexperia; Seremban; On-site; MYR 180,000 - 300,000; Full time

Job summary

Nexperia in Seremban, Malaysia seeks a Process Engineering Manager to lead the process engineering team and ensure process control, quality, and productivity targets are met. You will supervise direct reports and drive improvements in manufacturing lines such as Die Bond and Wire Bond.

You will collaborate with Engineering, Production, customers, and suppliers to expedite changes and manage risk within budget and schedule, while mentoring engineers in defining scope, time, and cost for complex

Qualifications

• Bachelor's degree in Engineering.
• ≥7 years in semiconductor manufacturing with strong process knowledge.
• Experience in Die Bond and Wire Bond processes.

Responsibilities

• Oversee process engineering team and ensure processes meet quality targets and productivity.
• Lead onboarding of new products within projects and scale.
• Develop and validate OQ/PQ protocols and reports.
• Provide on-line support for tool builds and trials.
• Collaborate with Engineering, Production, and suppliers to resolve issues promptly.
• Mentor engineers in scope, time, and cost management for complex projects.

Skills

Leadership

Analytical thinking

Risk management

Problem solving

Quality awareness

Communication skills

Education

Bachelor's degree in Engineering

Tools

Die Bond

Wire Bond

Job description

Nexperia in Seremban, Malaysia seeks a Process Engineering Manager to lead the process engineering team and ensure process control, quality, and productivity targets are met. You will supervise direct reports and drive improvements in manufacturing lines such as Die Bond and Wire Bond.

You will collaborate with Engineering, Production, customers, and suppliers to expedite changes and manage risk within budget and schedule, while mentoring engineers in defining scope, time, and cost for complex