Senior Engineer

Nexperia; Seremban; On-site; MYR 120,000 - 180,000; Full time

Job summary

Nexperia in Seremban is seeking a Senior Engineer to lead restoration and major overhauls for Die Bond, Wire Bond, and Buffer equipment. The role focuses on uptime, reliability, and continuous improvement while guiding floor technicians and coordinating with cross-functional teams.

You will apply RCA/PM practices, plan spare parts, and collaborate with vendors to implement improvements in a high-availability semiconductor assembly line.

Qualifications

• Bachelor's degree in engineering or related field; 5–8 years in semiconductor equipment maintenance.
• Experience with Die Bond, Wire Bond, and Buffer equipment.
• Strong troubleshooting, RCAs, and maintenance planning.

Responsibilities

• Lead equipment restoration, repair, and recovery for Die Bond, Wire Bond, and Buffer equipment.
• Drive uptime improvement and reliability initiatives to meet production goals.
• Perform RCA on chronic equipment issues and implement corrective actions.
• Develop and optimize preventive and predictive maintenance programs.
• Plan overhauls, refurbishments, upgrades, and spare parts strategies.
• Collaborate with cross-functional teams and mentor technicians.

Skills

Semiconductor equipment maintenance

Root cause analysis

Preventive maintenance

Troubleshooting

Project management

Cross-functional collaboration

Education

Bachelor's Degree in Electrical Engineering

Bachelor's Degree in Mechanical Engineering

Tools

Preventive maintenance software

FMEA tools

DOE

Job description

## Senior EngineerApply: Seremban: Full time: Posted Today: R-20014955### Job Summary### We are seeking a highly motivated Senior Engineer to join the RTR team. The successful candidate will be responsible for leading equipment restoration activities, major equipment repair and recovery projects, and continuous improvement initiatives within semiconductor assembly operations. The role will focus on supporting critical manufacturing processes including Die Bond, Wire Bond, and Buffer operations, while driving equipment reliability, uptime improvement, and technical competency development of floor technicians.### ### Key Responsibilities* ### Lead and coordinate major equipment restoration, repair, and recovery activities for Die Bond, Wire Bond, and Buffer process equipment.* ### Drive equipment reliability and uptime improvement initiatives to support manufacturing output and quality objectives.* ### Perform root cause analysis (RCA) on chronic equipment issues and implement sustainable corrective and preventive actions.* ### Develop and optimize preventive and predictive maintenance programs for production equipment.* ### Plan and manage major equipment overhauls, refurbishment, upgrades, and spare parts strategies.* ### Provide advanced troubleshooting support for equipment-related issues in Die Bond, Wire Bond, and Buffer operations.* ### Drive continuous improvement projects focused on equipment performance, productivity, quality, and cost reduction.* ### Collaborate with Production, Process Engineering, Manufacturing, Quality, and Maintenance teams to achieve operational excellence.* ### Lead technician skill enhancement programs through structured training, coaching, troubleshooting guidance, and knowledge-sharing initiatives.* ### Establish technical competency development plans for floor technicians to strengthen troubleshooting and maintenance capabilities.* ### Work closely with equipment vendors and suppliers on technical support, modifications, upgrades, and improvement projects.* ### Ensure compliance with safety, quality, and operational standards during all maintenance and engineering activities.* ### Monitor and analyze equipment performance indicators and recommend improvement actions.### ### Requirements### Education* ### Bachelor's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, or a related field.### ### Experience* ### Minimum 5-8 years of experience in semiconductor manufacturing, equipment engineering, or maintenance engineering.* ### Hands-on experience supporting Die Bond, Wire Bond, and Buffer processes is highly preferred.* ### Proven experience in equipment restoration, major breakdown recovery, equipment troubleshooting, and maintenance management.* ### Experience in leading technicians and driving cross-functional improvement initiatives.### ### Technical Skills* ### Strong knowledge of semiconductor assembly equipment and manufacturing processes.* ### Expertise in equipment restoration, troubleshooting, and failure analysis.* ### Strong understanding of Die Bond, Wire Bond, and Buffer equipment operations.* ### Knowledge of TPM, preventive maintenance, predictive maintenance, and reliability engineering principles.* ### Familiarity with RCA, FMEA, SPC, DOE, and continuous improvement methodologies.* ### Strong project management and technical leadership capabilities.### ### Key Focus Areas* ### Equipment restoration and major down repair management.* ### Die Bond, Wire Bond, and Buffer equipment support.* ### Equipment reliability and uptime improvement.* ### Technician competency development and skill enhancement.* ### Manufacturing productivity and operational excellence.* ### Continuous improvement and cost optimization.