Wire Bond Maintenance Lead — Uptime & Reliability

Nexperia; Seremban; On-site; MYR 180,000 - 240,000; Full time

Job summary

Nexperia in Malaysia seeks a senior maintenance leader to maximize Wire Bond equipment uptime and productivity. You will drive preventive maintenance, reliability improvements, and cost optimization while developing a team of engineers and technicians in a fast-paced semiconductor environment.

You will collaborate with Process Engineering, Production, and Quality to boost equipment performance, yield, and product quality, ensuring compliance with safety and ISO standards.

Qualifications

• Bachelor's Degree in Mechanical, Electrical, Mechatronics, or related Engineering discipline.
• 10+ years of experience in semiconductor manufacturing with strong exposure to equipment maintenance.
• 5+ years of leadership experience managing Engineering or Maintenance teams.
• Strong knowledge of Wire Bond equipment and semiconductor assembly manufacturing processes.
• Experience in equipment reliability, preventive maintenance, troubleshooting, and continuous improvement initiatives.
• Familiarity with TPM, Lean Manufacturing, SPC, and root cause analysis methodologies.
• Strong leadership, communication, problem-solving, and project management skills.

Responsibilities

• Lead and develop a team of Maintenance Engineers and Technicians.
• Develop and implement preventive and predictive maintenance strategies for Wire Bond equipment.
• Drive Overall Equipment Effectiveness (OEE) improvement initiatives.
• Minimize equipment downtime and improve MTTR and MTBF.
• Lead equipment reliability and continuous improvement projects to enhance manufacturing performance.
• Manage spare parts inventory, maintenance resources, and budget effectively.
• Support new equipment installation, qualification, buy-off, and production ramp activities.
• Ensure preventive maintenance (PM) compliance and maintenance effectiveness across all Wire Bond equipment.
• Lead root cause analysis and corrective actions for major equipment failures and recurring issues.
• Collaborate with Process Engineering, Production, and Quality teams to improve equipment performance, yield, and product quality.
• Drive cost reduction and maintenance optimization initiatives.
• Ensure compliance with Safety, ESD, ISO, and Quality Management System requirements.

Skills

Leadership

Team development

Maintenance strategy

OEE improvement

Root cause analysis

Project management

Communication

Education

Bachelor's Degree in Mechanical, Electrical, Mechatronics, or related Engineering

Tools

TPM

Lean Manufacturing

SPC

Root cause analysis methodologies

Job description

Nexperia in Malaysia seeks a senior maintenance leader to maximize Wire Bond equipment uptime and productivity. You will drive preventive maintenance, reliability improvements, and cost optimization while developing a team of engineers and technicians in a fast-paced semiconductor environment.

You will collaborate with Process Engineering, Production, and Quality to boost equipment performance, yield, and product quality, ensuring compliance with safety and ISO standards.