Process Development Engineer - Wire Bond & Yield Enhancement

Analog Devices, Inc.

Penang

On-site

MYR 180,000 - 300,000

Full time

14 days+

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Job summary

Analog Devices, Inc. in Penang, Malaysia is seeking experienced personnel to develop, set up and operate DA or wire bond (Cu/Au) processes.

The role includes establishing new machine recipes and working on modifications and tools to improve yield and process robustness. You will coordinate engineering/DOE evaluations, document procedures (ROHS, FMEA, control plans) and provide training to engineers, technicians, and operators.

Responsibilities

To develop, set up and operate DA or wire bond (Cu/Au) wire process.
To establish new machine recipe with suitable machine and process parameters on DA or wire bonder.
To work on machine modifications/tools/jigs fabrication for yield improvement or enhance Process robustness.
To work on yield improvement.
To coordinate engineering/DOE evaluations build and follow up closely until closure.
To work on documentation such as operating procedures, ROHS, FMEA, control plan etc.
To provide training to all parties such as engineers, technicians, operators, and trainer.
To recommend the best material & process flow for all the new product introduction.
To solve process issues in systematic way by correct analysis tools.