Senior Wirebond Process Engineer: Drive Yield & Innovation

Texas Instruments Incorporated; Malacca City; On-site; MYR 89,000 - 134,000; Full time

Job summary

Texas Instruments Incorporated is seeking a Manufacturing Process Engineer for its Melaka, Malaysia fab. The role focuses on developing improved manufacturing methods, supporting wirebond processes, and documenting processes to drive efficiency and quality in a high-volume 300mm wafer environment.

The candidate should have a 3.3 CGPA or higher and hands-on experience with KNS/ASM wirebond equipment, with wedge bonder experience a plus. Strong analytical and collaborative skills are essential.

Qualifications

• Bachelor's degree in Engineering or related field with CGPA above 3.3
• Experience with KNS and ASM wirebond machines in semiconductor manufacturing
• Wedge bonder experience is a plus
• Strong foundation in SPC, ECR, and process release strategies

Responsibilities

• Develop and implement improved manufacturing methods to boost efficiency, yields, and quality
• Support wirebond processes for customer deliverables
• Document wirebond process details in specs and work instructions
• Define wirebond materials for specific applications
• Define SPC methods supporting wire bond processes
• Execute improvement plans including efficiency, cost reduction or quality programs
• Perform lot and equipment dispositions to minimize cycle time in a high-volume 300mm wafer fab
• Identify and communicate process or equipment problems to engineering staff
• Support ramping of production with equipment startup and SWR experiments
• Participate in data analysis and problem resolution

Skills

Wirebond machines

Statistical methods

Process improvement

Team collaboration

Education

Bachelor's degree in Engineering or related field

Tools

KNS wirebond

ASM wirebond

Job description

Texas Instruments Incorporated is seeking a Manufacturing Process Engineer for its Melaka, Malaysia fab. The role focuses on developing improved manufacturing methods, supporting wirebond processes, and documenting processes to drive efficiency and quality in a high-volume 300mm wafer environment.

The candidate should have a 3.3 CGPA or higher and hands-on experience with KNS/ASM wirebond equipment, with wedge bonder experience a plus. Strong analytical and collaborative skills are essential.