Wire Bond Process & Equipment Optimization Engineer

ASE Electronics (M) Sdn Bhd; Bayan Lepas; On-site; MYR 60,000 - 90,000; Full time

Job summary

ASE Electronics (M) Sdn Bhd in Bayan Lepas, Penang, is seeking a Wire Bond Process & Equipment Engineer to design, develop and optimize wire bond processes for manufacturing to achieve delivery goals and quality.

The role focuses on improving yield, quality and productivity while driving cost reduction and interfacing with production, QA and support groups. A degree in Electronics/Electrical Engineering or Mechanical or equivalent is required, with basic knowledge of electronics/semiconductors.

Qualifications

• Degree in Electronics/Electrical Engineering or Mechanical or equivalent.
• Basic technical knowledge in Electronics/Semiconductors.

Responsibilities

• Develop, formulate, evaluate and execute process engineering to improve yield, quality and productivity.
• Monitor and disposition process-related concerns of the product.
• Characterize failures and determine implications on materials or machine trouble.
• Follow up on evaluations and handle line technical trouble.
• Interface with production, QA and other support groups on product/process problems.
• Prepare process instructions and train floor members.
• Review process requirements and customer specifications.
• Drive cost reduction projects or second source programs.
• Liaise with customers on yield and quality matters.

Job description

ASE Electronics (M) Sdn Bhd in Bayan Lepas, Penang, is seeking a Wire Bond Process & Equipment Engineer to design, develop and optimize wire bond processes for manufacturing to achieve delivery goals and quality.

The role focuses on improving yield, quality and productivity while driving cost reduction and interfacing with production, QA and support groups. A degree in Electronics/Electrical Engineering or Mechanical or equivalent is required, with basic knowledge of electronics/semiconductors.