Senior Process Development Engineer: Die Attach & Wire Bond

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang; Bayan Lepas; On-site; MYR 89,000 - 134,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang is seeking a process engineer to develop or optimize Die Attach and Wire Bond processes for new product development while meeting cost, quality, and timeline targets.

You will participate in FOL process technology roadmap activities, select suitable equipment, and transfer technical know-how to R&D and Manufacturing teams, mentoring junior staff where applicable.

Qualifications

• Bachelor's or Master's in Electrical/Electronics/Mechatronics/Mechanical Engineering or equivalent required.
• 2-3 years in semiconductor field, especially Die Attach and Wire Bond processes.
• Process engineering knowledge in semiconductors or LED manufacturing processes.

Responsibilities

• Develop or optimize Die Attach and Wire Bond processes for new product development projects.
• Participate in and support FOL process technology roadmap and building block activities.
• Select equipment meeting project cost, quality and timeline targets.
• Share and transfer technical know-how within R&D and to Manufacturing.

Skills

Die Attach

Wire Bond

Process Engineering

Statistical Methods

Minitab

Six Sigma Green/Black Belt

Education

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent

Job description

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang is seeking a process engineer to develop or optimize Die Attach and Wire Bond processes for new product development while meeting cost, quality, and timeline targets.

You will participate in FOL process technology roadmap activities, select suitable equipment, and transfer technical know-how to R&D and Manufacturing teams, mentoring junior staff where applicable.