Senior Process Engineer - Die Attach & Wire Bond

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd

Bayan Lepas

On-site

MYR 60,000 - 90,000

Full time

3 days ago
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Job summary

ams OSRAM Group in Penang is seeking a dedicated Process Engineer to develop or optimize Die Attach and Wire Bond processes for new product development projects. You will support FOL technology roadmap and build block activities, and participate in equipment selection to meet cost and timeline targets.

You will share technical know-how within R&D and Manufacturing, coach junior staff, and participate in engineering samples, pre-series and ramp-up builds to fulfill customer orders.

Qualifications

  • Degree or Master in Electrical/Electronics/Mechatronics/Mechanical Engineering or equivalent.
  • 2-3 years in semiconductor field.
  • 2-3 years in Die Attach and Wire Bond processes.
  • Process engineering knowledge in semiconductors or LED manufacturing processes.
  • Knowledge in process development steps and statistics.
  • Minitab knowledge will be advantageous.
  • Six Sigma Green or Black Belt will be advantageous.

Responsibilities

  • Develop or optimize Die Attach and Wire Bond processes for new product development project to meet project cost, quality and timeline targets.
  • Participate and support FOL processes technology roadmap and building block activities.
  • Equipment selection which meet project cost, quality and timeline target.
  • Share and transfer technical know how within R&D and to Manufacturing team.
  • Provide technical guidance or job coaching to junior supporting staff.
  • Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

Skills

Die Attach
Wire Bond
Process development
Statistics
Six Sigma Green/Black Belt

Education

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent

Tools

Minitab

Job description

ams OSRAM Group in Penang is seeking a dedicated Process Engineer to develop or optimize Die Attach and Wire Bond processes for new product development projects. You will support FOL technology roadmap and build block activities, and participate in equipment selection to meet cost and timeline targets.

You will share technical know-how within R&D and Manufacturing, coach junior staff, and participate in engineering samples, pre-series and ramp-up builds to fulfill customer orders.

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