Lead Power Module Packaging Engineer

Randstad Malaysia; Ampang Jaya; On-site; MYR 60,000 - 120,000; Full time

Job summary

Randstad Malaysia seeks an experienced Packaging Engineer to lead development activities for advanced semiconductor power module packages, covering structure, materials, and integration. You will drive process optimization and manufacturability across cross-functional teams to support technology development and cost competitiveness.

The role requires hands-on experience in power module packaging, DOE/DFM/SPC methods, and a track record of delivering NPI from prototyping to production release.

Qualifications

• Bachelor's degree in a relevant engineering or physics field.
• 5–12 years of semiconductor packaging experience, with hands-on exposure to power modules.
• Strong understanding of module package structures, materials, and integration.
• Experience in packaging process development, material selection, and assembly integration.
• Familiarity with advanced packaging tech such as SiP, ETS, MIS, PoL, SMT, and power modules.
• Knowledge of DFM, process optimization, and semiconductor assembly tech.
• Experience in project management related to packaging development or NPI.
• Strong analytical, problem-solving, and cross-functional collaboration skills.

Responsibilities

• Lead packaging engineering and development activities for advanced power module packages.
• Develop and optimize packaging processes including attach, flip-chip, reflow, molding, and leadframe assembly.
• Drive new product development from prototyping to manufacturing release.
• Evaluate package configurations for reliability and compatibility.
• Collaborate with cross-functional teams to support technology development and process improvements.
• Drive yield, process optimization, defect reduction, and cost competitiveness.
• Apply DOE, FMEA, SPC, and statistical analysis to resolve challenges.

Skills

Packaging engineering

Power module packaging

Process integration

New product introduction

DOE

FMEA

SPC

Statistical analysis

Cross-functional collaboration

Education

Bachelor's Degree in Mechanical Engineering

Tools

SiP

ETS

MIS

PoL

TO/SiC/GaN power modules

Job description

Randstad Malaysia seeks an experienced Packaging Engineer to lead development activities for advanced semiconductor power module packages, covering structure, materials, and integration. You will drive process optimization and manufacturability across cross-functional teams to support technology development and cost competitiveness.

The role requires hands-on experience in power module packaging, DOE/DFM/SPC methods, and a track record of delivering NPI from prototyping to production release.