Senior Power Module Packaging Engineer

ON Semiconductor Malaysia Sdn. Bhd.; Seremban; On-site; MYR 120,000 - 200,000; Full time

Job summary

onsemi Malaysia Sdn. Bhd. seeks a senior packaging development engineer to lead new package technology and platform module development for power modules.

You will drive development activities from feasibility through LAR, ensuring manufacturability, cost targets and quality requirements, while partnering with design, materials, and process teams. Responsibilities include following APQP processes, coordinating with cross-functional teams, and delivering on-time milestones with RCCA-driven problem

Qualifications

• 8+ years in package development.
• Power module package development with B2S/B6S experience is a plus.
• BS or MS degree.
• Fluent in English; familiar with JMP, Minitab, AutoCAD and MS Office.

Responsibilities

• New Package Technology and New Platform Module Development.
• Responsible for new package/technology development following APQP.
• Familiar with DFM to ensure robust manufacturability and quality.
• Drive problem solving with risk assessment and RCCA.
• Strong knowledge of device-package interaction and team collaboration.

Skills

Power module packaging

English fluency

JMP

Minitab

AutoCAD

Education

BS or MS degree

Tools

AutoCAD

MS Office

Minitab

JMP

Job description

onsemi Malaysia Sdn. Bhd. seeks a senior packaging development engineer to lead new package technology and platform module development for power modules.

You will drive development activities from feasibility through LAR, ensuring manufacturability, cost targets and quality requirements, while partnering with design, materials, and process teams. Responsibilities include following APQP processes, coordinating with cross-functional teams, and delivering on-time milestones with RCCA-driven problem