Senior Power Packaging Engineer – SiP/Flip-Chip Systems

Renesas Electronics Corporation; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

Renesas Electronics Corporation is seeking a senior packaging professional in Penang, Malaysia, to design and develop power packaging solutions (Power SiP/modules, flip-chip LGA, and multi-chip modules) and to collaborate with OSAT/CM partners for DOE-driven process optimization and production qualification.

The role requires strong communication, analytical skills, and a background in semiconductor power device packaging, with hands-on experience in leadframe and metallization processes.

Qualifications

• Master's or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 5-15 years of relevant experience in package development (leadframe, laminate, power QFN/SiP/module, flip-chip packaging).
• Understanding of semiconductor power device package assembly processes, materials and technology.
• Knowledge of AutoCAD, Excel, PowerPoint, Word.
• Knowledge of wafer front-side / backside metallization, wire-bonding, flip chip, multi-chip module, SPC and statistical analysis.

Responsibilities

• Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging.
• Work with OSAT/CM to develop DOEs to optimize processes and establish specifications.
• Collaborate with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
• Ensure smooth production transition by resolving process integration issues and establishing production controls.
• Develop and maintain technical expertise on advances in leadframe, power SiP/modules, and flip chip interconnects.
• Address customer complaints with Marketing, Product groups, Quality and Operations to support growth.

Skills

AutoCAD

Excel

PowerPoint

Word

Strong communication

Analytical skills

Education

Master's or Bachelor's in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Tools

wafer metallization

Job description

Renesas Electronics Corporation is seeking a senior packaging professional in Penang, Malaysia, to design and develop power packaging solutions (Power SiP/modules, flip-chip LGA, and multi-chip modules) and to collaborate with OSAT/CM partners for DOE-driven process optimization and production qualification.

The role requires strong communication, analytical skills, and a background in semiconductor power device packaging, with hands-on experience in leadframe and metallization processes.