Senior Packaging Engineer, Power Modules & SiP

Texas Instruments; Malacca City; On-site; MYR 120,000 - 200,000; Full time

Job summary

Texas Instruments in Malaysia is seeking an experienced Manufacturing Packaging Engineer to optimize high-speed attachment processes, streamline stack-up and molding, and drive robust process parameters across product families.

You will lead multi-project executions from kick-off through prototyping, qualification, and RTM, collaborate with factory operations and global teams, and contribute to technology roadmaps enabling competitive, reliable power module packaging.

Qualifications

• Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or a related field.
• CGPA 3.3 or above and at least 5 years of manufacturing semiconductor experience.
• Hands-on skills operating machines and optimizing materials/processes for yield improvement.

Responsibilities

• Optimize and establish robust, high-speed process parameters for component attach, stack-up, and molding technologies.
• Define simplified manufacturing sequences for different components attach.
• Lead multi-project executions from kick-off through prototyping, characterization, learning cycles, and qualifications to RTM.
• Collaborate closely with factory operations to meet indices, quality, and cost targets.
• Engage with global teams to execute technology roadmaps and establish process capabilities.

Skills

Manufacturing experience

Process optimization

Yield improvement

Machine operation

Cross-functional collaboration

Education

Bachelor’s degree in Mechanical Engineering, Physics, Material Science, or related field

Tools

JMP

Job description

Texas Instruments in Malaysia is seeking an experienced Manufacturing Packaging Engineer to optimize high-speed attachment processes, streamline stack-up and molding, and drive robust process parameters across product families.

You will lead multi-project executions from kick-off through prototyping, qualification, and RTM, collaborate with factory operations and global teams, and contribute to technology roadmaps enabling competitive, reliable power module packaging.