Senior Power Package Design Engineer for AI & HPC

Renesas Electronics Corp.; Bayan Lepas; Presencial; MYR 120.000 - 180.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Competitive benefits package

Descripción de la vacante

Renesas Electronics Corp. in Penang, Bayan Lepas, is seeking a skilled packaging engineer to design and develop advanced package and interconnect solutions, including Power SiP/modules and flip-chip packaging.

You will coordinate with OSAT/CM teams to optimize processes and qualify new packages, ensuring smooth transition to production. The role requires 5–15 years in package development, with strong knowledge of metallization, wire-bonding, and statistical methods, and collaboration with

Formación

• Masters or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 5–15 years of experience in package development emphasizing leadframe, laminate, power SiP/module, flip-chip packaging, FSM/BM metallization processing.
• Knowledge of AutoCAD, Excel, PowerPoint, Word; wafer metallization, wire-bonding, flip chip, MCM; SPC and statistical analysis.

Responsabilidades

• Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging.
• Collaborate with OSAT/CM to run DOEs to optimize processes and set specifications.
• Work with Product Groups and Reliability teams to qualify new packages and processes within required timelines.
• Ensure smooth production transition by resolving process integration issues and establishing production controls.
• Develop technical expertise on advances in leadframe, power SiP/modules, and flip chip interconnects.
• Address customer complaints with Marketing, Product groups, Quality and Operations to support growth.

Conocimientos

Interpersonal skills

Analytical skills

Presentation skills

Educación

Master's/Bachelor's in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Herramientas

AutoCAD

Excel

PowerPoint

Word

SPC

Statistical analysis

Descripción del empleo

Renesas Electronics Corp. in Penang, Bayan Lepas, is seeking a skilled packaging engineer to design and develop advanced package and interconnect solutions, including Power SiP/modules and flip-chip packaging.

You will coordinate with OSAT/CM teams to optimize processes and qualify new packages, ensuring smooth transition to production. The role requires 5–15 years in package development, with strong knowledge of metallization, wire-bonding, and statistical methods, and collaboration with