Senior Power Package Design Engineer for AI/HPC & SiP

Renesas Electronics (Malaysia); Bayan Lepas; On-site; MYR 120,000 - 190,000; Full time

Job summary

Renesas Electronics (Malaysia) is seeking a seasoned package development engineer to design and optimize power SiP/modules, flip-chip LGA, and multi-chip modules, contributing to advanced packaging for AI/HPC and VPD applications.

You will collaborate with OSAT/CM, Product Groups, Reliability, and Quality teams to qualify new packages, resolve process issues, and transfer to production, leveraging your 5-15 years of relevant experience and proficiency in AutoCAD, Excel, and related tools.

Qualifications

• 5–15 years of experience in package development (leadframe, laminate, QFN/SiP).
• Understanding of semiconductor power device package assembly processes and materials.
• Proficiency with AutoCAD, Excel, PowerPoint and Word.
• Excellent interpersonal, analytical and presentation skills.

Responsibilities

• Design and develop package and interconnect methods for Power SiP/modules and flip-chip packaging.
• Collaborate with OSAT/CM to run DOEs, optimize processes, and set specs.
• Work with Product Groups and Reliability to qualify new packages within timelines.
• Ensure smooth production transfer by resolving process issues and controls.
• Maintain expertise on advances in leadframe, Power SiP/modules, and flip-chip interconnects.
• Address customer complaints with Marketing, Product, Quality, and Operations teams.

Skills

Interpersonal communication

Analytical skills

Presentation skills

Education

Physics, Chemistry, Mechanical, Electrical or Materials Eng degree

Tools

AutoCAD

Excel

PowerPoint

Word

Job description

Renesas Electronics (Malaysia) is seeking a seasoned package development engineer to design and optimize power SiP/modules, flip-chip LGA, and multi-chip modules, contributing to advanced packaging for AI/HPC and VPD applications.

You will collaborate with OSAT/CM, Product Groups, Reliability, and Quality teams to qualify new packages, resolve process issues, and transfer to production, leveraging your 5-15 years of relevant experience and proficiency in AutoCAD, Excel, and related tools.