Senior Power Packaging Engineer for AI/HPC & SiP

Renesas Electronics (Malaysia); Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

Renesas Electronics (Malaysia) in Bayan Lepas is seeking a seasoned packaging engineer to design and develop power SiP/modules, flip-chip packaging, and interconnect methods.

You will collaborate with OSAT/CM, Product Groups, Reliability, and Operations to qualify new packages and ensure smooth production ramp, addressing process integration issues and enabling high density, high reliability power packaging solutions.

Qualifications

• Masters/Bachelors in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
• 5–15 years of experience in package development emphasizing leadframe, laminate, power SiP/module, flip-chip packaging, and wafer front-side/backside metallization

Responsibilities

• Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, multi-chip module and power device packaging
• Work with OSAT/CM to develop, run DOEs to optimize processes and establish process specifications
• Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame
• Ensure smooth transition into production by resolving all process integration issues, establishing production controls and monitors, and monitoring/resolving process issues
• Develop and maintain technical expertise on advances and innovations in advanced leadframe, power SiP/modules, and flip chip interconnects
• Address internal and external customer complaints with Marketing, Product groups, Quality and Operations to satisfy growth in businesses

Skills

Leadframe packaging

Laminate packaging

Wafer metallization

Statistical analysis

Education

Masters in Engineering

Bachelors in Physics

Tools

AutoCAD

Excel

PowerPoint

Word

Job description

Renesas Electronics (Malaysia) in Bayan Lepas is seeking a seasoned packaging engineer to design and develop power SiP/modules, flip-chip packaging, and interconnect methods.

You will collaborate with OSAT/CM, Product Groups, Reliability, and Operations to qualify new packages and ensure smooth production ramp, addressing process integration issues and enabling high density, high reliability power packaging solutions.