Senior Power Package Design Engineer

Renesas Electronics Corp.; Bayan Lepas; On-site; MYR 120,000 - 180,000; Full time

Job summary

Renesas Electronics Corp. in Penang, Malaysia, is seeking a senior package development engineer to design and qualify advanced power packaging solutions, including Power SiP and flip-chip modules, for AI/HPC applications.

You will collaborate with OSAT/CM, Product Groups, and Reliability teams to optimize processes, establish production controls, and ensure smooth transfer to production while delivering reliable, high-density interconnects.

Qualifications

• Bachelor’s or Master’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 5–15 years of experience in package development emphasizing leadframe, laminate, power SiP/module, flip-chip packaging, and FSM/BM metallization.
• Knowledge of AutoCAD, Excel, PowerPoint and Word; wafer metallization, wire-bonding, flip-chip, multi-chip module; SPC and statistical analysis.
• Strong interpersonal and communication skills; analytical and presentation abilities.

Responsibilities

• Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, multi-chip module, and power device packaging.
• Collaborate with OSAT/CM to run DOEs to optimize processes and establish specifications.
• Coordinate with Product Groups and Reliability teams to qualify new packages and processes within timeframes.
• Ensure smooth production transfer by solving process integration issues and implementing production controls and monitoring.
• Develop and maintain expertise on advances in leadframes, power SiP/modules, and flip chip interconnects.
• Address customer complaints in collaboration with Marketing, Product Groups, Quality and Operations.

Skills

Strong interpersonal skills

Strong analytical skills

Excellent presentation skills

Strong communication skills

Education

Master's or Bachelor's degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

Tools

AutoCAD

Excel

PowerPoint

Word

Job description

Renesas Electronics Corp. in Penang, Malaysia, is seeking a senior package development engineer to design and qualify advanced power packaging solutions, including Power SiP and flip-chip modules, for AI/HPC applications.

You will collaborate with OSAT/CM, Product Groups, and Reliability teams to optimize processes, establish production controls, and ensure smooth transfer to production while delivering reliable, high-density interconnects.