Senior FOL Packaging Engineer: High-Power NPI Lead

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 180,000 - 250,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Car subsidy

Job summary

Carsem (M) Sdn. Bhd is seeking a senior packaging engineer to lead the design and development of high-power discrete and power module packages in Ipoh, Malaysia.

You will translate customer requirements into specifications and collaborate across design, materials, and process teams to optimize package structures and assembly flows. You will apply DFM principles to ensure robust production, cost control, and quality compliance, while overseeing electrical, thermal and reliability characterization

Qualifications

• Bachelor’s or Master’s Degree in Mechanical, Electrical, Materials Engineering or related field.
• At least 5 years of experience in high-power discrete or power module packaging development.
• Proven track record leading NPI projects from concept through HVM transfer.
• In-depth knowledge of FOL processes including SiC wafer dicing, solder reflow and gel-fill modules, and reliability standards.

Responsibilities

• Lead end-to-end design and development of high-power discrete and power module packaging.
• Translate customer requirements into PRS and SCD.
• Collaborate with design, materials, and process teams to optimize structures and flows.
• Apply DFM to ensure robust production, cost control and quality.
• Oversee electrical, thermal and reliability characterization and qualification.
• Develop and maintain DFMEA, PFMEA, QFD, LAR, control plans and procurement specs.
• Drive NPI project timelines, deliverables and risk mitigation.
• Mentor junior engineers and drive continuous improvement; support audits.

Skills

Power packaging

Device-package interaction

Material reliability testing

WBG packaging roadmaps

AutoCAD

JMP

Minitab

Excel

PowerPoint

NPI planning

Risk-based thinking

Milestone tracking

Cross-functional communication

Leadership

8D/RCCA

Education

Bachelor’s or Master’s Degree in Mechanical, Electrical, Materials Engineering

Tools

AutoCAD

JMP

Minitab

Excel

PowerPoint

Job description

Carsem (M) Sdn. Bhd is seeking a senior packaging engineer to lead the design and development of high-power discrete and power module packages in Ipoh, Malaysia.

You will translate customer requirements into specifications and collaborate across design, materials, and process teams to optimize package structures and assembly flows. You will apply DFM principles to ensure robust production, cost control, and quality compliance, while overseeing electrical, thermal and reliability characterization