Lead Advanced Packaging: 2.5D/3D IC Innovation

Pride Global; Seberang Perai; On-site; MYR 180,000 - 260,000; Full time

Job summary

Pride Global seeks an experienced Lead Advanced Packaging Design Engineer to drive the development and integration of next-generation semiconductor packaging technologies, focusing on 2.5D/3D IC integration and heterogeneous architectures.

You will lead cross-functional teams across design, DFT, SI/PI, thermal, and manufacturing, shaping long-term technology strategies and ensuring manufacturability, reliability, and scalability of complex packaging programs.

Qualifications

• Master's or PhD in Electrical Engineering, Materials Science, Electronics Engineering, or related technical discipline.
• Minimum 10 years in semiconductor packaging design and development with 5+ years in advanced packaging tech.

Responsibilities

• Lead architecture, design, and development of advanced packaging solutions (FOWLP, 2.5D/3D, CoWoS, EMIB).
• Establish design rules and workflows for multi-die integration and high-density interconnects.
• Collaborate with silicon design, DFT, SI/PI, thermal, mechanical, and manufacturing teams to optimize packaging.
• Drive technology roadmaps for heterogeneous integration and chiplet-based systems.
• Provide technical leadership and mentoring to engineers; ensure on-time, within-budget delivery.

Skills

Advanced packaging design

2.5D/3D IC integration

FOWLP/CoWoS/EMIB

Cross-functional leadership

Education

Master's or PhD in Electrical Engineering or related field

Tools

Cadence Allegro

Siemens EDA Xpedition

Ansys simulation

Job description

Pride Global seeks an experienced Lead Advanced Packaging Design Engineer to drive the development and integration of next-generation semiconductor packaging technologies, focusing on 2.5D/3D IC integration and heterogeneous architectures.

You will lead cross-functional teams across design, DFT, SI/PI, thermal, and manufacturing, shaping long-term technology strategies and ensuring manufacturability, reliability, and scalability of complex packaging programs.