Senior Advanced IC Packaging Architect (2.5D/3D)

Bitdeer Technologies Group; Penang; On-site; MYR 180,000 - 300,000; Full time

Job summary

Bitdeer Technologies Group in Penang, Malaysia, is seeking a Lead Packaging Design Engineer to drive architecture, simulation and production of advanced chip packaging solutions. You will coordinate cross‑functional teams on die placement, substrate stack‑ups, power delivery and signoff for reliability, cost and schedule.

Strong leadership and hands‑on expertise are essential. Join a world‑leading AI and mining technology group with global scale and opportunities to influence next‑gen packaging

Qualifications

• Bachelor’s degree or above in electrical engineering or related field.
• 10+ years of chip packaging design or development experience.
• Experience leading a complex packaging project from architecture through production.
• Knowledge of flip-chip/FC-BGA, substrate design, and high-speed interconnects.
• Hands-on depth in at least one area (package design, SI/PI, thermal or thermo‑mechanical analysis).
• Strong English communication and cross-functional leadership.

Responsibilities

• Define packaging roadmaps and architectures, assess manufacturability and risks.
• Lead chip-package-board co-design and drive design closure.
• Lead SI, PI, thermal and thermomechanical analyses with clear signoff criteria.
• Coordinate prototype testing and model correlation to resolve issues.
• Interface with foundries, assembly/test partners and vendors for ramp.
• Establish design reviews, version control and documentation practices.
• Recruit and mentor packaging design engineers and build reusable methods.

Skills

Chip packaging design

Leadership

SI/PI/thermal analysis

English communication

Education

Bachelor’s degree or above in electrical engineering / microelectronics / materials / mechanical engineering

Tools

EDA/simulation tools

Job description

Bitdeer Technologies Group in Penang, Malaysia, is seeking a Lead Packaging Design Engineer to drive architecture, simulation and production of advanced chip packaging solutions. You will coordinate cross‑functional teams on die placement, substrate stack‑ups, power delivery and signoff for reliability, cost and schedule.

Strong leadership and hands‑on expertise are essential. Join a world‑leading AI and mining technology group with global scale and opportunities to influence next‑gen packaging