Senior Package Development Engineer (Semiconductor Packaging)

Infineon Technologies AG

Malacca City

On-site

MYR 80,000 - 140,000

Full time

5 days ago

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Job summary

Infineon Technologies AG in Malaysia seeks a Senior Engineer to advance package development within its Research & Development team. You will blend creativity with deep technical expertise to shape innovative packaging solutions, drive major project changes, and deliver reliable, cost-effective designs.

The role requires a Bachelor's in engineering and 2–3 years in IC/semiconductor packaging, with knowledge of processing, reliability, and testing.

Qualifications

Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Electronics Physics).
2–3 years of relevant experience in an IC/semiconductor environment.
Knowledge of semiconductor packaging, assembly, and testing.
Understanding of process and equipment engineering.
Knowledge of failure analysis and reliability engineering.
AutoCAD and 3D drafting proficiency preferred.

Responsibilities

Drive technical definition activities for package projects, including BOM, design, and cost review.
Generate conceptual package outlines and internal construction drawings.
Finalize and maintain package drawings with updates as required.
Define package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
Coordinate package cost estimation (A1-A3) and cost indication (A3).
Liaise with partners on back-end assembly technology and project lifecycle involvement.