Senior Manager, AI Power IC Packaging & Assembly

Renesas; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

Renesas Electronics seeks a Senior Manager of Semiconductor IC Packaging & Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies, including SiP, 2.5D/3D concepts, and SiC/GaN. You will coordinate with Packaging, OSATs, and R&D to ramp NPI programs to production.

The role emphasizes yield, process control, change management, and manufacturing readiness, with cross-functional collaboration across Quality, Supply Chain, and

Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline.
• 15+ years of semiconductor manufacturing and packaging engineering experience with exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
• 3+ years leading technical projects, mentoring engineers, or managing small teams in semiconductor environments.
• Strong expertise in FET wafer metallization, wirebond, flip chip, reflow, molding, and package assembly processes.

Responsibilities

• Support sustaining engineering across semiconductor package assembly technologies and product lines.
• Execute high-volume manufacturing improvements for yield, cycle time, quality, throughput, and cost.
• Develop and maintain engineering practices for process control, defect reduction, and continuous improvement.
• Contribute technical input to assembly engineering roadmaps aligned with package technology and business needs.
• Work with Package Engineering and OSAT teams to ensure manufacturable designs and robust production controls.
• Monitor assembly yield performance, trends, and corrective action progress.
• Execute data-driven yield improvement initiatives using statistical methods and problem-solving.
• Investigate process reliability and customer quality issues through root-cause analysis.
• Maintain KPIs and dashboards to track manufacturing performance and engineering effectiveness.
• Partner with Quality and Reliability teams to meet standards and audits.
• Support containment, corrective, and preventive actions for manufacturing and field quality issues.
• Ensure process controls and qualification requirements across OSAT sites.
• Coordinate ramp execution with cross-functional teams for NPI-to-HVM transitions.
• Provide technical guidance and mentorship to assembly engineering teams.
• Strengthen processes and capabilities to support evolving business needs.
• Contribute packaging expertise to support product execution, customer readiness, and ramp.

Skills

Semiconductor packaging

Yield analysis

Data-driven problem solving

OSAT partner management

NPI to HVM ramp

Process control methodologies

Cross-functional collaboration

Statistical analysis tools

Education

Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline

Tools

SPC software

DOE methods

Quality management systems

Job description

Renesas Electronics seeks a Senior Manager of Semiconductor IC Packaging & Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies, including SiP, 2.5D/3D concepts, and SiC/GaN. You will coordinate with Packaging, OSATs, and R&D to ramp NPI programs to production.

The role emphasizes yield, process control, change management, and manufacturing readiness, with cross-functional collaboration across Quality, Supply Chain, and