Senior Manager / Manager, Semiconductor Packaging & Assembly Engineering

Private Advertiser; Hang Tuah Jaya; On-site; MYR 180,000 - 360,000; Full time

Job summary

Private Advertiser in Malaysia seeks a Senior Manager / Manager in Semiconductor Packaging & Assembly Engineering to lead manufacturing packaging and assembly activities, driving yield improvement and cost optimization.

You will support NPI and HVM ramps, develop robust process controls, and mentor engineering teams while collaborating with internal and external partners to raise manufacturing performance and reliability.

Qualifications

• Bachelor's Degree in Engineering or related disciplines.
• Minimum 12 years in semiconductor packaging/assembly/manufacturing engineering.
• Experience with OSATs or outsourced semiconductor manufacturing partners.
• Experience with NPI-to-HVM transfer and product ramp.
• Knowledge of JEDEC, IPC standards preferred.

Responsibilities

• Lead packaging and assembly engineering activities for manufacturing operations.
• Drive yield improvement, defect reduction, quality enhancement, and cost optimization.
• Support NPI and HVM ramp activities.
• Develop and improve assembly process controls and best practices.
• Conduct root cause analysis and implement corrective actions.
• Collaborate with internal teams and external partners to resolve issues.
• Monitor KPIs and drive continuous improvement.
• Provide technical leadership and mentoring to engineering teams.

Skills

Yield Improvement

SPC

DOE

FMEA

Reliability Engineering

Process Qualification

Statistical Analysis

Education

Bachelor's Degree in Engineering or related disciplines

Job description

Senior Manager / Manager, Semiconductor Packaging & Assembly Engineering

Key Responsibilities

Lead semiconductor packaging and assembly engineering activities for manufacturing operations.

Drive yield improvement, defect reduction, quality enhancement, and cost optimization initiatives.

Support New Product Introduction (NPI) and High Volume Manufacturing (HVM) ramp activities.

Develop and improve assembly process controls and manufacturing best practices.

Conduct root cause analysis and implement corrective and preventive actions.

Support product, process, material, equipment, and site qualifications.

Collaborate with internal teams and external manufacturing partners to resolve technical issues and improve manufacturing performance.

Monitor manufacturing KPIs and drive continuous improvement programs.

Lead cross-functional engineering projects and technical problem-solving activities.

Provide technical leadership, coaching, and mentoring to engineering teams.

Requirements

Bachelor's Degree in Engineering, Materials Science, Electronics, Electrical, Mechanical, Chemical Engineering, or related disciplines.

Minimum 12 years of experience in semiconductor packaging, assembly engineering, manufacturing engineering, process engineering, or related semiconductor manufacturing environments. Candidates with 15+ years of experience and demonstrated technical leadership will be considered for Senior Manager level.

Experience in semiconductor package assembly processes such as:

• Flip Chip
• Molding
• SMT
• System-in-Package (SiP)
• Multi-Chip Module (MCM)

Strong knowledge of:

• Yield Improvement
• SPC
• DOE
• FMEA
• Reliability Engineering
• Process Qualification
• Statistical Analysis

Experience supporting NPI-to-HVM transfer and product ramp activities.

Experience working with OSATs or outsourced semiconductor manufacturing partners.

Strong stakeholder management, communication, project management, and leadership skills.

Experience in Power Semiconductor Packaging, Smart Power Stage (SPS), Vertical Power Stage (VPS), Power Modules, Discrete FET, SiC, GaN, or Advanced Packaging technologies will be an added advantage.

Familiarity with JEDEC, IPC, Automotive, Industrial, and Power Semiconductor standards is preferred.