Lead Advanced Packaging Architect for High-Power HPC Chips

Bitdeer; Malaysia; On-site; MYR 180,000 - 240,000; Full time

Benefits offered by this job

Competitive welfare benefits

Training and mentoring

Autonomy and fast growth

Job summary

Bitdeer is seeking a Staff / Principal Advanced Packaging Engineer to lead packaging architecture, technology strategy, and high-volume manufacturing execution for next-generation HPC silicon. This is a high-impact, hands-on technical leadership role responsible for driving advanced packaging from concept through mass production.

You will define the company’s packaging roadmap, lead cross-functional chip-package-board co-design, and ensure scalable, reliable production for large-die, high-power

Qualifications

• Bachelor's degree or above in Microelectronics or related field.
• 8+ years in advanced semiconductor packaging or related experience.
• Experience bringing complex semiconductor products from concept to high-volume production.
• Hands-on with high-layer-count FCBGA packaging technologies.
• Expert-level substrate layout review using Cadence APD/Allegro or equivalent.
• Strong SI/PI knowledge for high-performance devices.
• Understanding of thermal/mechanical challenges in packaging, warpage management.
• Familiarity with JEDEC reliability and failure analysis techniques.
• Excellent communication and cross-functional collaboration.

Responsibilities

• Define packaging architecture and technology strategy for HPC silicon.
• Lead cross-functional chip-package-board co-design with silicon and hardware teams.
• Govern packaging programs, establish design rules, schedules, and quality standards.
• Oversee NPI, mass production, and supplier engagement to mitigate risks.

Skills

Packaging architecture

Technology strategy

NPI leadership

SI/PI analysis

Thermal & mechanical design

Vendor management

Cross-functional leadership

High-volume manufacturing

Education

Bachelor's degree in Microelectronics / Semiconductor Engineering

Tools

Cadence APD

Allegro

Ansys

Flotherm

Job description

Bitdeer is seeking a Staff / Principal Advanced Packaging Engineer to lead packaging architecture, technology strategy, and high-volume manufacturing execution for next-generation HPC silicon. This is a high-impact, hands-on technical leadership role responsible for driving advanced packaging from concept through mass production.

You will define the company’s packaging roadmap, lead cross-functional chip-package-board co-design, and ensure scalable, reliable production for large-die, high-power