Senior Packaging Architect - Drive Next-Gen IC Packaging

Infineon Technologies AG; Malacca City; Vor Ort; MYR 180.000 - 240.000; Vollzeit

Zusammenfassung

Infineon Technologies AG in Malaysia seeks a Senior Staff Engineer for Package Technology in our R&D team. You will drive technical definitions for major package projects, develop layouts and drawings, and ensure designs meet electrical, thermal, mechanical, and reliability requirements.

You will coordinate cost estimation activities and act as a technical consultant across divisions, while proactively scouting new packaging technologies and leading pre-development efforts.

Qualifikationen

• Bachelor's Degree in Engineering, preferable in Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, or Physics.
• Minimum 7 years of relevant working experience in the IC or semiconductor industry.
• Strong knowledge of semiconductor packaging, assembly and test processes, and equipment engineering.
• Knowledge of failure analysis and reliability engineering.

Aufgaben

• Drive technical definition activities for package projects with major changes or business impacts, including BOM, package design, assembly technology, PRP reviews, and project classification.
• Develop conceptual package outlines and internal construction drawings, finalize and document package designs, and maintain drawing updates as required.
• Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.
• Coordinate package cost estimation activities (A1-A3) and cost indication processes (A3).
• Serve as the key liaison and technical consultant to Business Divisions on package definition, particularly regarding backend assembly technology expertise.
• Support pre-development and project definition phases, and act as the package design expert throughout the project lifecycle.
• Proactively scout emerging packaging technologies and maintain awareness of developments within competitors and subcontractors.
• Consolidate inputs for ADR and ensure content accuracy and timely updates for A-projects.
• Act as the primary contact person, technical consultant, and coach for all matters related to packaging, package design, and package development.
• Drive innovation and pre-development activities within the package platform.

Kenntnisse

Semiconductor packaging

Assembly & test processes

Failure analysis

Reliability engineering

Analytical skills

AutoCAD

3D drafting

Backend assembly technology

Ausbildung

Bachelor's Degree in Engineering

Tools

AutoCAD

3D drafting

Jobbeschreibung

Infineon Technologies AG in Malaysia seeks a Senior Staff Engineer for Package Technology in our R&D team. You will drive technical definitions for major package projects, develop layouts and drawings, and ensure designs meet electrical, thermal, mechanical, and reliability requirements.

You will coordinate cost estimation activities and act as a technical consultant across divisions, while proactively scouting new packaging technologies and leading pre-development efforts.