NPI Engineer, Wafer-Level Packaging

onsemi; Kuala Selangor; In loco; MYR 200.000 - 320.000; Tempo pieno

Descrizione del lavoro

onsemi is seeking a skilled NPI Engineer (Assembly Packaging) to drive new production introduction for wafer-level packaging and post-fab solutions. You will lead cross-functional teams, shaping manufacturing strategies and delivering advanced packaging solutions for next-generation silicon.

The role emphasizes DFM readiness, collaboration with OSATs, and data-driven decision making to ensure on-time market release and ramp readiness.

Competenze

• More than 10 years of backend semiconductor IC manufacturing experience.
• Hands-on WLP, bumping and post-fab expertise including plating and surface finishing.
• Strong cross-functional collaboration and project management skills.

Mansioni

• Lead backend NPI from concept to production launch with focus on WLP and post-fab solutions.
• Provide functional leadership for NPI, coordinating internal and external stakeholders.
• Drive DFM and manufacturability readiness for new product development.
• Partner with OSATs to deliver assembly readiness and qualification activities.
• Manage ramp and provide technical support to resolve ramp issues.
• Develop data-driven problem solving and establish best-in-class methods.

Conoscenze

NPI leadership

WLP packaging

DFM readiness

Data analytics

DOE characterization

Cross-functional collaboration

Project management

Statistical analysis

Formazione

Bachelor's Degree in Engineering/Materials Science

Strumenti

CAD

FEA

Simulation

Descrizione del lavoro

onsemi is seeking a skilled NPI Engineer (Assembly Packaging) to drive new production introduction for wafer-level packaging and post-fab solutions. You will lead cross-functional teams, shaping manufacturing strategies and delivering advanced packaging solutions for next-generation silicon.

The role emphasizes DFM readiness, collaboration with OSATs, and data-driven decision making to ensure on-time market release and ramp readiness.